驅動微波混成IC組裝技術至毫米波頻段(I)

Title:	驅動微波混成IC組裝技術至毫米波頻段(I) Moving Microwave Hybrid Integrated Circuit Assembly Technology Toward Millimeter-Wave Regime (I)
Authors:	莊晴光 TZUANG CHING-KUANG C 交通大學電信工程系
Keywords:	毫米波;包裝電晶體;印刷電路板;行波放大器;振盪器;混成微波組裝;Millimeter wave;Packaged transistor;PCB;Traveling-wave amplifier (TWA);Osillator;Hybrid microwave assembly
Issue Date:	1999
Gov't Doc #:	NSC88-2213-E009-101
URI:	http://hdl.handle.net/11536/94483 https://www.grb.gov.tw/search/planDetail?id=429311&docId=76855
Appears in Collections:	Research Plans