| Title: | 銅化學氣相沈積技術及在深次微米積體電路之應用研究(II) Cu-CVD Technology and Reliability Issues of Cu Metallization Relevant to ULSI Application(II) |
| Authors: | 陳茂傑 交通大學電子工程系 |
| Keywords: | 銅化學氣相沈積法;深次微米;積體電路;擴散障礙;鈍化;Cu-CVD;Deep submicrometer;IC;Diffusion barrier;Passivation |
| Issue Date: | 1999 |
| Gov't Doc #: | NSC88-2215-E009-044 |
| URI: | http://hdl.handle.net/11536/94531 https://www.grb.gov.tw/search/planDetail?id=444194&docId=80440 |
| Appears in Collections: | Research Plans |
