銅化學氣相沈積技術及積體電路銅製程相關的材料與製程技術研究

Title:	銅化學氣相沈積技術及積體電路銅製程相關的材料與製程技術研究 Cu-CVD Technology and Reliability Issues of Cu Metallization Relevant to ULSI Application
Authors:	陳茂傑交通大學電子工程系
Keywords:	銅化學氣相沈積;孔槽填充技術;銅﹧介電材料系統之熱穩定性;鉭基障礙層;銅膜表面鈍化;Cu-CVD;Via/trench filling;Thermal stability of Cu/dielectric;Ta-based barrier;Passivation of Cu
Issue Date:	2000
Gov't Doc #:	NSC89-2215-E009-029
URI:	http://hdl.handle.net/11536/92852 https://www.grb.gov.tw/search/planDetail?id=528098&docId=96282
Appears in Collections:	Research Plans