晶圓製造廠再加工策略之研究

Full metadata record

DC Field	Value	Language
dc.contributor.author	沙永傑	en_US
dc.contributor.author	SHA YUNG-JYE ( D. Y.	en_US
dc.date.accessioned	2014-12-13T10:37:22Z	-
dc.date.available	2014-12-13T10:37:22Z	-
dc.date.issued	1999	en_US
dc.identifier.govdoc	NSC88-2213-E009-029	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/94580	-
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=443248&docId=80224	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.language.iso	zh_TW	en_US
dc.subject	再加工	zh_TW
dc.subject	晶圓製造	zh_TW
dc.subject	在製品	zh_TW
dc.subject	利用率	zh_TW
dc.subject	交期	zh_TW
dc.subject	Rework	en_US
dc.subject	Wafer fabrication	en_US
dc.subject	Work in process	en_US
dc.subject	Utilization	en_US
dc.subject	Due date	en_US
dc.title	晶圓製造廠再加工策略之研究	zh_TW
dc.title	A Study on the Rework Strategies of Wafer Fabrication Factory	en_US
dc.type	Plan	en_US
dc.contributor.department	交通大學工業工程與管理系	zh_TW
Appears in Collections:	Research Plans

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