多層導體連線平坦化之研究---電鍍銅之電解拋光技術

標題:	多層導體連線平坦化之研究---電鍍銅之電解拋光技術 Planarization Investigation of Multi-layer Interconnects---Electropolishing Technology for Electroplated Copper
作者:	馮明憲國立交通大學材料科學工程研究所
關鍵字:	平坦化;多層連結線;電解拋光;電鍍銅;Planarization;Multilayer interconnect;Electropolishing;Electroplated copper
公開日期:	2001
官方說明文件#:	NSC90-2215-E009-062
URI:	http://hdl.handle.net/11536/96852 https://www.grb.gov.tw/search/planDetail?id=665679&docId=126368
Appears in Collections:	Research Plans

Files in This Item:

If it is a zip file, please download the file and unzip it, then open index.html in a browser to view the full text content.