標題: | 適用於無線通訊之互補式金氧半積體電路-總計畫 CMOS Integrated Circuits for Wireless Communication |
作者: | 吳重雨 CHUNG-YUWU 國立交通大學電子工程研究所 |
關鍵字: | 互補式金氧半;積體電路;無線通信;CMOS;Integrated circuit;Wireless communication |
公開日期: | 2001 |
官方說明文件#: | NSC90-2215-E009-115 |
URI: | http://hdl.handle.net/11536/97517 https://www.grb.gov.tw/search/planDetail?id=660688&docId=125044 |
Appears in Collections: | Research Plans |
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