標題: 適用於無線通訊之互補式金氧半積體電路-總計畫
CMOS Integrated Circuits for Wireless Communication
作者: 吳重雨
CHUNG-YUWU
國立交通大學電子工程研究所
關鍵字: 互補式金氧半;積體電路;無線通信;CMOS;Integrated circuit;Wireless communication
公開日期: 2001
官方說明文件#: NSC90-2215-E009-115
URI: http://hdl.handle.net/11536/97517
https://www.grb.gov.tw/search/planDetail?id=660688&docId=125044
Appears in Collections:Research Plans


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