Title: 利用鑽石矽複合基板以製作高散熱的高功率發光二極體
Using Diamond/Si Composite Substrate for High Power Leds
Authors: 吳耀銓
WU YEWCHUNG SERMON
國立交通大學材料科學與工程學系(所)
Keywords: 人工鑽石顆粒;晶圓接合;圖案化的結構化矽;Artificial diamond particles;wafer bonding processes;structure Si
Issue Date: 2012
Abstract: 本計畫是利用人工鑽石顆粒的高導熱性質,製作出高散熱基板。取代原有的LED 基板,進而改善高功率發光二極體在高電流驅動下的散熱問題。其中(1)利用大尺寸 (~200μm)的鑽石顆粒,以有效的利用鑽石的高導熱性質。加上(2)則是利用圖案化的 結構化矽,裸露出矽走道做為切割區域,將可避開直接切割到鑽石導致的問題。
This project is about fabricating high thermal conductivity diamond/Si composite substrate to replace LED substrate. (1) Using 200μm artificial diamond particles to increase substrate thermal conductivity. (2)Using “structure” Si substrate to define the cutting path for LED devices.
Gov't Doc #: NSC101-2221-E009-053-MY3
URI: http://hdl.handle.net/11536/98842
https://www.grb.gov.tw/search/planDetail?id=2584756&docId=389703
Appears in Collections:Research Plans