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dc.contributor.authorChen, Wei-Renen_US
dc.contributor.authorChang, Ting-Changen_US
dc.contributor.authorYeh, Jui-Lungen_US
dc.contributor.authorChang, Chun-Yenen_US
dc.date.accessioned2014-12-08T15:12:51Z-
dc.date.available2014-12-08T15:12:51Z-
dc.date.issued2008en_US
dc.identifier.issn0013-4651en_US
dc.identifier.urihttp://hdl.handle.net/11536/9902-
dc.identifier.urihttp://dx.doi.org/10.1149/1.2971189en_US
dc.description.abstractThe stored charge characteristics of Ni-silicide nanocrystals embedded in nitride formed by annealing a Ni-Si-N thin film were studied in this paper. We used X-ray photoelectron spectroscopy, leakage current density, and X-ray diffraction to offer chemical material analysis of nanocrystals with surrounding dielectric and the crystallization of nanocrystals for different thermal annealing treatments. Transmission electron microscope analyses revealed nanocrystals embedded in the nitride layer. Nonvolatile Ni-Si nanocrystal memories with 600 degrees C annealing revealed superior electrical characteristics for charge-storage capacity and reliability compared with the memories with 300 and 500 degrees C annealing. In addition, we used energy-band diagrams to explain the significance of surrounding dielectric for reliability. (C) 2008 The Electrochemical Society.en_US
dc.language.isoen_USen_US
dc.titleEnhancement of charge-storage performance in Ni-silicide nanocrystal devices by thermal annealing a Ni-Si-N thin filmen_US
dc.typeArticleen_US
dc.identifier.doi10.1149/1.2971189en_US
dc.identifier.journalJOURNAL OF THE ELECTROCHEMICAL SOCIETYen_US
dc.citation.volume155en_US
dc.citation.issue11en_US
dc.citation.spageH869en_US
dc.citation.epageH872en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000259528200064-
dc.citation.woscount3-
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