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公開日期標題作者
1-七月-2018Investigation and Optimization of Ultrathin Buffer Layers Used in Cu/Sn Eutectic BondingTang, Ya-Sheng; Chen, Hsiu-Chi; Kho, Yi-Tung; Hsieh, Yu-Sheng; Chang, Yao-Jen; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-十一月-2017Investigation of Co Thin Film as Buffer Layer Applied to Cu/Sn Eutectic Bonding and UBM With Sn, SnCu, and SAC Solders JointsTang, Ya-Sheng; Derakhshandeh, Jaber; Kho, Yi-Tung; Chang, Yao-Jen; Slabbekoorn, John; De Preter, Inge; Vanstreels, Kris; Rebibis, Kenneth June; Beyne, Eric; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-七月-2011Investigation of Organizational Interaction and Support in an NGO through Computer-Mediated DiscussionsChang, Yao-Jen; Chang, Yao-Sheng; 經營管理研究所; Institute of Business and Management
1-十二月-2015A Novel Flexible 3-D Heterogeneous Integration Scheme Using Electroless Plating on Chips With Advanced Technology NodeHu, Yu-Chen; Lin, Chun-Pin; Chang, Yao-Jen; Chang, Nien-Shyang; Sheu, Ming-Hwa; Chen, Chi-Shi; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2015Quality and Reliability Investigation of Ni/Sn Transient Liquid Phase Bonding TechnologyTsai, Tsung-Yen; Chang, Yao-Jen; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-十月-2019Reliability of stable fiber Bragg grating sensor system for monitoring temperature and strain individuallyChang, Yao-Jen; Yeh, Chien-Hung; Chow, Chi-Wai; 光電工程學系; 光電工程研究所; Department of Photonics; Institute of EO Enginerring
2014Research of Electroplating and Electroless Plating for Low Temperature Bonding in 3D Heterogeneous IntegrationHu, Yu-Chen; Chang, Yao-Jen; Wu, Chun-Shen; Cheng, Yung Mao; Chen, Wei Jen; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-一月-2019A Selectable Single-Mode Erbium Laser With Power-Flattened Output Employing Dual-Sagnac-RingYeh, Chien-Hung; Lin, Wen-Piao; Chang, Yao-Jen; Xie, Yue-Ru; Luo, Chien-Ming; Chow, Chi-Wai; 光電工程學系; 光電工程研究所; Department of Photonics; Institute of EO Enginerring
1-十一月-2014Submicron Cu/Sn Bonding Technology With Transient Ni Diffusion Buffer Layer for 3DIC ApplicationChang, Yao-Jen; Hsieh, Yu-Sheng; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-六月-2018Switchable dual-wavelength single-longitudinal-mode erbium fiber laser utilizing a dual-ring scheme with a saturable absorberYang, Zi-Qing; Huang, Tzu-Jung; Chang, Yao-Jen; Yeh, Chien-Hung; Chow, Chi-Wai; Chen, Jing-Heng; Chen, Kun-Huang; 光電工程學系; Department of Photonics
1-十一月-2019Utilizing polarization-multiplexing for free space optical communication transmission with security operationYeh, Chien-Hung; Chang, Yao-Jen; Chow, Chi-Wai; Lin, Wen-Piao; 光電工程學系; 光電工程研究所; Department of Photonics; Institute of EO Enginerring
1-一月-2019Utilizing Single Lightwave for Delivering Baseband/FSO/MMW Traffics Simultaneously in PON ArchitectureYeh, Chien-Hung; Lin, Wen-Piao; Luo, Chien-Ming; Xie, Yue-Ru; Chang, Yao-Jen; Chow, Chi-Wai; 光電工程學系; 光電工程研究所; Department of Photonics; Institute of EO Enginerring
1-二月-2012Wafer-level Cu-Cu bonding technologyTang, Ya-Sheng; Chang, Yao-Jen; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-六月-2012A Wafer-Level Three-Dimensional Integration Scheme With Cu TSVs Based on Microbump/Adhesive Hybrid Bonding for Three-Dimensional Memory ApplicationKo, Cheng-Ta; Hsiao, Zhi-Cheng; Chang, Yao-Jen; Chen, Peng-Shu; Hwang, Yu-Jiau; Fu, Huan-Chun; Huang, Jui-Hsiung; Chiang, Chia-Wen; Sheu, Shyh-Shyuan; Chen, Yu-Hua; Lo, Wei-Chung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2011三維積體電路關鍵技術之金屬高分子混合接合研究張耀仁; Chang, Yao-Jen; 陳冠能; Chen, Kuan-Neng; 電子研究所
2016三維積體電路關鍵技術與異質接合製程平台之電性與可靠度研究張耀仁; 陳冠能; Chang, Yao-Jen; Chen, Kuan-Neng; 電子工程學系 電子研究所
2009產品觸覺風格的探討－以握杯為例張耀仁; Chang, Yao-Jen; 莊明振; Chuang, Ming-Chuen; 應用藝術研究所
顯示 21 到 37 筆資料，總共 37 筆 < 上一頁