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Showing results 21 to 40 of 45 < previous   next >
Issue DateTitleAuthor(s)
1-Oct-2010Growth of Multiple Metal/Semiconductor Nanoheterostructures through Point and Line Contact ReactionsWu, W. W.; Lu, K. C.; Wang, C. W.; Hsieh, H. Y.; Chen, S. Y.; Chou, Y. C.; Yu, S. Y.; Chen, L. J.; Tu, K. N.; 材料科學與工程學系; Department of Materials Science and Engineering
1-Oct-2010Growth of Multiple Metal/Semiconductor Nanoheterostructures through Point and Line Contact ReactionsWu, W. W.; Lu, K. C.; Wang, C. W.; Hsieh, H. Y.; Chen, S. Y.; Chou, Y. C.; Yu, S. Y.; Chen, L. J.; Tu, K. N.; 材料科學與工程學系; Department of Materials Science and Engineering
2009In-situ TEM Study of Electromigration in Cu linesLiao, C. N.; Chen, K. C.; Wu, W. W.; Chen, L. J.; Tu, K. N.; 材料科學與工程學系; Department of Materials Science and Engineering
2010In-situ Transmission Electron Microscopy Study of Nanotwinned Copper under ElectromigrationLiao, Chien-Neng; Chen, Kuan-Chia; Wu, Wen-Wei; Chen, Lih-Juann; Tu, K. N.; 材料科學與工程學系; Department of Materials Science and Engineering
1-Jul-2011The Influence of Surface Oxide on the Growth of Metal/Semiconductor NanowiresLu, Kuo-Chang; Wu, Wen-Wei; Ouyang, Hao; Lin, Yung-Chen; Huang, Yu; Wang, Chun-Wen; Wu, Zheng-Wei; Huang, Chun-Wei; Chen, Lih J.; Tu, K. N.; 材料科學與工程學系; Department of Materials Science and Engineering
1-Nov-2011Inhibiting the consumption of Cu during multiple reflows of Pb-free solder on CuHsiao, H. -Y.; Hu, C. -C.; Guo, M. -Y.; Chen, C.; Tu, K. N.; 材料科學與工程學系; Department of Materials Science and Engineering
1-Jan-2019Low resistance and high reliable Cu-to-Cu joints using highly (111)-oriented nano-twinned copperJuang, Jing Ye; Shie, Kai Cheng; Li, Yu Jin; Tu, K. N.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
1-Jan-2019Low-resistance and high-strength copper direct bonding in no-vacuum ambient using highly (111)-oriented nano-twinned copperJuang, Jing Ye; Shie, Kai Cheng; Hsu, Po-Ning; Li, Yu Jin; Tu, K. N.; Chen, Chin; 材料科學與工程學系; Department of Materials Science and Engineering
2015Low-temperature and low pressure copper-to-copper direct bonding enabled by creep on highly (111)-oriented Cu surfacesTseng, Chih-Han; Liu, Chien-Min; Lin, Han-wen; Chu, Yi-Cheng; Chen, Chih; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, K. N.; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
2016LOW-TEMPERATURE AND LOW-PRESSURE DIRECT COPPER-TO-COPPER BONDING BY HIGHLY (111)-ORIENTED NANOTWINNED CUChen, Chih; Liu, Chien-Min; Lin, Han-Wen; Huang, Yi-Sa; Chu, Yi-Cheng; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, K. N.; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
1-Jan-2019Low-temperature Cu-to-Cu direct bonding enabled by highly (111)-oriented and nanotwinned CuChen, Chih; Juang, Jing-Ye; Chang, Shih Yang; Shie, Kai Cheng; Li, Yu Jin; Tu, K. N.; 材料科學與工程學系; Department of Materials Science and Engineering
1-May-2014Low-temperature direct copper-to-copper bonding enabled by creep on highly (111)-oriented Cu surfacesLiu, Chien-Min; Lin, Han-Wen; Chu, Yi-Cheng; Chen, Chih; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, K. N.; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
1-Mar-2007Mechanism of electromigration-induced failure in flip-chip solder joints with a 10-mu m-thick Cu under-bump metallizationNah, Jae-Woong; Chen, Kai; Tu, K. N.; Su, Bor-Rung; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
1-Aug-2013Microstructure control of unidirectional growth of eta-Cu6Sn5 in microbumps on < 1 1 1 > oriented and nanotwinned CuLin, Han-wen; Lu, Chia-ling; Liu, Chien-min; Chen, Chih; Chen, Delphic; Kuo, Jui-Chao; Tu, K. N.; 材料科學與工程學系; Department of Materials Science and Engineering
1-Dec-2009Nonuniform and Negative Marker Displacements Induced by Current Crowding During Electromigration in Flip-Chip Sn-0.7Cu Solder JointsLiang, S. W.; Hsiao, Hsiang-Yao; Chen, Chih; Xu, Luhua; Tu, K. N.; Lai, Yi-Shao; 材料科學與工程學系; Department of Materials Science and Engineering
22-Aug-2008Observation of atomic diffusion at twin-modified grain boundaries in copperChen, Kuan-Chia; Wu, Wen-Wei; Liao, Chien-Neng; Chen, Lih-Juann; Tu, K. N.; 材料科學與工程學系; Department of Materials Science and Engineering
2012Side Wall Wetting Induced Void Formation due to Small Solder Volume in Microbumps of Ni/SnAg/Ni upon ReflowLiang, Y. C.; Chen, C.; Tu, K. N.; 材料科學與工程學系; Department of Materials Science and Engineering
15-Sep-2010Stability of nanoscale twins in copper under electric current stressingChen, Kuan-Chia; Wu, Wen-Wei; Liao, Chien-Neng; Chen, Lih-Juann; Tu, K. N.; 材料科學與工程學系; Department of Materials Science and Engineering
15-Sep-2010Stability of nanoscale twins in copper under electric current stressingChen, Kuan-Chia; Wu, Wen-Wei; Liao, Chien-Neng; Chen, Lih-Juann; Tu, K. N.; 材料科學與工程學系; Department of Materials Science and Engineering
1-Mar-2007Stress analysis of spontaneous Sn whisker growthTu, K. N.; Chen, Chih; Wu, Albert T.; 材料科學與工程學系; Department of Materials Science and Engineering
Showing results 21 to 40 of 45 < previous   next >