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公開日期標題作者
1-三月-2003Improving the quality of electroplated copper films by rapid thermal annealingChang, SC; Shieh, JM; Dai, BT; Feng, MS; Wang, YL; 材料科學與工程學系; Department of Materials Science and Engineering
15-一月-2004Integration of a stack of two fluorine doped silicon oxide film with ULSI interconnect metallizationCheng, YL; Wang, YL; Liu, CP; Wu, YL; Lo, KY; Liu, CW; Lan, JK; Ay, C; Feng, MS; 材料科學與工程學系; Department of Materials Science and Engineering
1-十一月-2001Integration of MOCVD titanium nitride with collimated titanium and ion metal plasma titanium for 0.18-mu m logic processLan, JK; Wang, YL; Lo, KY; Liu, CP; Liu, CW; Wang, JK; Cheng, YL; Chau, CG; 材料科學與工程學系; Department of Materials Science and Engineering
1-九月-1997Integration of modified plasma-enhanced chemical vapor deposited tetraethoxysilane intermetal dielectric and chemical-mechanical polishing processes for 0.35 mu m IC device reliability improvementWang, YL; Tseng, WT; Feng, MS; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
1-九月-1997Integration of modified plasma-enhanced chemical vapor deposited tetraethoxysilane intermetal dielectric and chemical-mechanical polishing processes for 0.35 mu m IC device reliability improvementWang, YL; Tseng, WT; Feng, MS; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
24-二月-2006Investigation of overpotential and seed thickness on damascene copper electroplatingChen, KW; Wang, YL; Chang, L; Li, FY; Chang, SC; 材料科學與工程學系; Department of Materials Science and Engineering
1-三月-2006Mechanism for Cu void defect on various electroplated film conditionsFeng, HP; Cheng, MY; Wang, YL; Chang, SC; Wang, YY; Wan, CC; 材料科學與工程學系; Department of Materials Science and Engineering
1-九月-2003Mechanisms of circular defects for shallow trench isolation oxide depositionLan, JK; Wang, YL; Liu, CP; Chao, CG; Ay, CY; Liu, CW; Cheng, YL; 材料科學與工程學系; Department of Materials Science and Engineering
2-十一月-1998A modified multi-chemical spray cleaning process for post shallow trench isolation chemical mechanical polishing cleaning applicationWang, YL; Wang, TC; Wu, J; Tseng, WT; Lin, CF; 材料科學與工程學系; Department of Materials Science and Engineering
1-一月-1998A modified multi-chemicals spray cleaning process for post-CMP cleaning applicationWang, YL; Liu, C; Feng, MS; Tseng, WT; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
1-一月-1998A modified multi-chemicals spray cleaning process for post-CMP cleaning applicationWang, YL; Liu, C; Feng, MS; Tseng, WT; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
24-一月-2005Modified polycrystalline silicon chemical-vapor deposition process for improving roughness at oxide/polycrystalline silicon interfaceChang, JJ; Hsieh, TE; Wang, YL; Tseng, WT; Liu, CP; Lan, CY; 材料科學與工程學系; Department of Materials Science and Engineering
30-一月-2004Moisture resistance and thermal stability of fluorine-incorporation siloxane-based low-dielectric-constant materialCheng, YL; Wang, YL; Wu, YL; Liu, CP; Liu, CW; Lan, JK; O'Neil, ML; Ay, C; Feng, MS; 材料科學與工程學系; Department of Materials Science and Engineering
30-一月-2004Monitor and eliminate the circular defects in HDP-STI deposition through oxynitride/oxide composite linerLan, JK; Wang, YL; Liu, CP; Lee, WH; Ay, C; Cheng, YL; Chang, SC; 材料科學與工程學系; Department of Materials Science and Engineering
1-三月-2006Novel slurry solution for dishing elimination in copper process beyond 0.1-mu m technologyChen, KW; Wang, YL; Liu, CP; Chang, L; Li, FY; 材料科學與工程學系; Department of Materials Science and Engineering
2001Novel strategies of FSG-CMP for within-wafer uniformity improvement and wafer edge yield enhancement beyond 0.18 micro technologiesChen, KW; Wang, YL; Chang, L; Liu, CW; Lin, YK; Wang, TC; Chang, ST; Lo, KY; 材料科學與工程學系; Department of Materials Science and Engineering
1-七月-2004Optimization of post-N-2 treatment and undoped-Si-glass cap to improve metal wring delamination in deep submicron high-density plasma-fluorinated silica glass intermetal dielectric applicationCheng, YL; Wang, YL; Lan, JK; Wu, SA; Chang, SC; Lo, KY; Feng, MS; 材料科學與工程學系; Department of Materials Science and Engineering
1-三月-2006Oxide-mediated fort-nation of epitaxy silicide on heavily doped Si surfaces and narrow width active regionChen, YM; Tu, GC; Wang, YL; 材料科學與工程學系; Department of Materials Science and Engineering
2004Pattern-dependent copper microcorrosion from CMPChen, KW; Wang, YL; Chang, L; Chang, SC; Li, FY; Lin, SH; 材料科學與工程學系; Department of Materials Science and Engineering
24-二月-2006Precipitates formation and its impact on the structure of plasma-deposited fluorinated silicon oxide filmsWu, J; Wang, YL; Kuo, CT; 材料科學與工程學系; Department of Materials Science and Engineering
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