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公開日期標題作者
1-九月-1997Integration of modified plasma-enhanced chemical vapor deposited tetraethoxysilane intermetal dielectric and chemical-mechanical polishing processes for 0.35 mu m IC device reliability improvementWang, YL; Tseng, WT; Feng, MS; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
1-九月-1997Integration of modified plasma-enhanced chemical vapor deposited tetraethoxysilane intermetal dielectric and chemical-mechanical polishing processes for 0.35 mu m IC device reliability improvementWang, YL; Tseng, WT; Feng, MS; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
1-十一月-2002Investigation of carrying agents on microstructure of electroplated Cu filmsShieh, JM; Chang, SC; Dai, BT; Feng, MS; 材料科學與工程學系; Department of Materials Science and Engineering
1-八月-2002Investigation of superfilling and electrical characteristics in low-impurity-incorporated Cu metallizationShieh, JM; Chang, SC; Dai, BT; Feng, MS; 材料科學與工程學系; Department of Materials Science and Engineering
1-三月-1997Investigation of the indium atom interdiffusion on the growth of GaN/InGaN heterostructuresTsang, JS; Guo, JD; Chan, SH; Feng, MS; Chang, CY; 交大名義發表; National Chiao Tung University
1-五月-2001Investigations of effects of bias polarization and chemical parameters on morphology and filling capability of 130 nm damascene electroplated copperChang, SC; Shieh, JM; Lin, KC; Dai, BT; Wang, TC; Chen, CF; Feng, MS; Li, YH; Lu, CP; 材料科學與工程學系; Department of Materials Science and Engineering
1-十一月-2002Investigations of pulse current electrodeposition for damascene copper metalsChang, SC; Shieh, JM; Dai, BT; Feng, MS; 材料科學與工程學系; Department of Materials Science and Engineering
1-十一月-2002Leveling effects of copper electrolytes with hybrid-mode additivesLin, KC; Shieh, JM; Chang, SC; Dai, BT; Chen, CF; Feng, MS; Li, YH; 材料科學與工程學系; Department of Materials Science and Engineering
2003Low temperature polycrystalline silicon thin film transistors fabricated by electroless plating Ni induced crystallization of amorphous SiChao, CW; Wu, YCS; Chen, YC; Hu, GR; Feng, MS; 材料科學與工程學系; Department of Materials Science and Engineering
1-一月-1995Microcrystallinity of undoped amorphous silicon films and its effects on the transfer characteristics of thin film transistorsLiang, CW; Chiang, WC; Feng, MS; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-十一月-1995Microcrystallinity of undoped amorphous silicon films and its effects on the transfer characteristics of thin-film transistorsLiang, CW; Chiang, WC; Feng, MS; 材料科學與工程學系; 電控工程研究所; 奈米中心; Department of Materials Science and Engineering; Institute of Electrical and Control Engineering; Nano Facility Center
1-九月-2002Microleveling mechanisms and applications of electropolishing on planarization of copper metallizationChang, SC; Shieh, JM; Huang, CC; Dai, BT; Li, YH; Feng, MS; 材料科學與工程學系; Department of Materials Science and Engineering
12-五月-1997Mobility enhancements in AlGaN/GaN/SiC with stair-step and graded heterostructuresLin, CF; Cheng, HC; Huang, JA; Feng, MS; Guo, JD; Chi, GC; 材料科學與工程學系; 電子工程學系及電子研究所; 奈米中心; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics; Nano Facility Center
12-五月-1997Mobility enhancements in AlGaN/GaN/SiC with stair-step and graded heterostructuresLin, CF; Cheng, HC; Huang, JA; Feng, MS; Guo, JD; Chi, GC; 材料科學與工程學系; 電子工程學系及電子研究所; 奈米中心; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics; Nano Facility Center
1997Modified double-layer PECVD passivation films for improving nonvolatile memory IC performanceLin, CF; Tseng, WT; Feng, MS; Chang, YF; 交大名義發表; 材料科學與工程學系; National Chiao Tung University; Department of Materials Science and Engineering
1-一月-1998A modified multi-chemicals spray cleaning process for post-CMP cleaning applicationWang, YL; Liu, C; Feng, MS; Tseng, WT; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
1-一月-1998A modified multi-chemicals spray cleaning process for post-CMP cleaning applicationWang, YL; Liu, C; Feng, MS; Tseng, WT; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
30-一月-2004Moisture resistance and thermal stability of fluorine-incorporation siloxane-based low-dielectric-constant materialCheng, YL; Wang, YL; Wu, YL; Liu, CP; Liu, CW; Lan, JK; O'Neil, ML; Ay, C; Feng, MS; 材料科學與工程學系; Department of Materials Science and Engineering
15-十月-1999Nitric acid-based slurry with citric acid as an inhibitor for copper chemical mechanical polishingHu, TC; Chiu, SY; Dai, BT; Tsai, MS; Tung, IC; Feng, MS; 材料科學與工程學系; Department of Materials Science and Engineering
1-十月-1999The novel improvement of low dielectric constant methylsilsesquioxane by N2O plasma treatmentChang, TC; Liu, PT; Mor, YS; Sze, SM; Yang, YL; Feng, MS; Pan, FM; Dai, BT; Chang, CY; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
顯示 41 到 60 筆資料，總共 92 筆 < 上一頁   下一頁 >