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Issue DateTitleAuthor(s)
20053-D simulation on current density distribution in flip-cbip solder joints with thick CuUBM under current stressingLiang, SW; Shao, TL; Chen, C; 材料科學與工程學系; Department of Materials Science and Engineering
1-Sep-2003Abnormal and regioselective Wacker oxidation of 1,5-dienesHo, TL; Chang, MH; Chen, C; 應用化學系; Department of Applied Chemistry
1-May-2006Aging influence of poly(ethylene glycol) suppressors of Cu electrolytes on gaps fillingLiu, SH; Li, TC; Chen, C; Shieh, JM; Dai, BT; Hensen, K; Cheng, SS; 材料科學與工程學系; Department of Materials Science and Engineering
1-Jul-2001A complete fault diagnostic system for automated vehicles operating in a platoonRajamani, R; Howell, AS; Chen, C; Hedrick, JK; Tomizuka, M; 機械工程學系; Department of Mechanical Engineering
1-May-2006Critical length of electromigration for eutectic SnPb solder stripeWei, CC; Chen, C; 材料科學與工程學系; Department of Materials Science and Engineering
1-Dec-2004Cross interactions on interfacial compound formation of solder bumps and metallization layers during reflowShao, TL; Chen, TS; Huang, YM; Chen, C; 材料科學與工程學系; Department of Materials Science and Engineering
1-Aug-2001Cross-reference maximum likelihood reconstruction for positron emission tomography with empiric studiesChen, J; Tu, K; Chen, T; Lu, H; Liu, R; Chou, K; Chen, C; 統計學研究所; Institute of Statistics
1-Sep-2001Design of a scalable multiprocessor architecture and its simulationPean, DL; Wu, CC; Chua, HT; Chen, C; 資訊工程學系; Department of Computer Science
2005DISCOUNT: A hybrid probability-based broadcast scheme for wireless ad hoc networksHsu, CK; Chen, C; Wang, HK; 資訊工程學系; Department of Computer Science
1-Oct-2005Dynamics of nutritional health in older hospitalized patients in TaiwanChen, C; Huang, G; Tu, H; Liu, Y; 交大名義發表; National Chiao Tung University
24-Apr-2006Effect of Al-trace dimension on Joule heating and current crowding in flip-chip solder joints under accelerated electromigrationLiang, SW; Chang, YW; Chen, C; 材料科學與工程學系; Department of Materials Science and Engineering
2005An effect scheme for fixed-length tunnel allocation in hierarchical WDM networksLo, TY; Chen, C; Chen, YY; 資訊工程學系; Department of Computer Science
1998Effective mechanisms to reduce the overhead of migratory sharing for linked-based cache coherence protocols in clustering multiprocessor architecturePean, DL; Wu, JR; Chen, C; 資訊工程學系; Department of Computer Science
1998Effective parallelization techniques for non-uniform loopsPean, DL; Wu, CC; Chua, HT; Chen, C; 資訊科學與工程研究所; Institute of Computer Science and Engineering
1-May-2001Effects of construction on laterally loaded pile groupsHuang, AB; Hsueh, CK; O'Neill, MW; Chern, S; Chen, C; 土木工程學系; Department of Civil Engineering
1-Feb-2004Electromigration at the high-Pb-eutectic SnPb solder interfaceLai, CL; Lin, CH; Chen, C; 材料科學與工程學系; Department of Materials Science and Engineering
2004Electromigration failure mechanism of Sn96.5Ag3.5 flip-chip solder bumpsShao, TL; Chen, IH; Chen, C; 材料科學與工程學系; Department of Materials Science and Engineering
15-Oct-2004Electromigration failure mechanisms for SnAg3.5 solder bumps on Ti/Cr-Cu/Cu and Ni(P)/Au metallization padsShao, TL; Chen, YH; Chiu, SH; Chen, C; 材料科學與工程學系; Department of Materials Science and Engineering
2005Electromigration in eutectic SnPb solder bumps with Ni/Cu UBMChiu, SH; Liang, SW; Chen, C; Lin, SS; Chou, CM; Liu, YC; Chen, KH; 材料科學與工程學系; Department of Materials Science and Engineering
1-Aug-2005Electromigration in pb-free SnAg3.8Cu0.7 solder stripesHsu, YC; Chou, CK; Liu, PC; Chen, C; Yao, DJ; Chou, T; Tu, KN; 材料科學與工程學系; Department of Materials Science and Engineering
Showing results 1 to 20 of 70  next >