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公開日期標題作者
17-四月-2014CIRCUIT BOARD WITH TWINNED CU CIRCUIT LAYER AND METHOD FOR MANUFACTURING THE SAMECHEN Chih; LIN Han-Wen
14-十一月-2013Electric connecting structure comprising preferred oriented Cu6Sn5 grains and method for fabricating the sameCHEN Chih; LIN Han-Wen
7-八月-2014Electrical Connecting Element and Method for Manufacturing the SameCHEN Chih; LIU Taochi; HUANG Yi-Sa; LIU Chien-Min
3-四月-2014ELECTRICAL CONNECTING ELEMENT HAVING NANO-TWINNED COPPER, METHOD OF FABRICATING THE SAME, AND ELECTRICAL CONNECTING STRUCTURE COMPRISING THE SAMECHEN Chih; CHIU Wei-Lan
16-五月-2013Electrodeposited Nano-Twins Copper Layer and Method of Fabricating the SameCHEN Chih; TU King-Ning; LIU Taochi
14-二月-2013METHOD FOR INHIBITING GROWTH OF INTERMETALLIC COMPOUNDSCHEN Chih; TU King-Ning; HSIAO Hsiang-Yao
5-三月-2015SINGLE CRYSTAL COPPER, MANUFACTURING METHOD THEREOF AND SUBSTRATE COMPRISING THE SAMECHEN Chih; TU King-Ning; LU Chia-Ling
10-一月-2013SPECIMEN BOX FOR ELECTRON MICROSCOPECHEN Chih; TU King-Ning
10-一月-2013SPECIMEN BOX FOR ELECTRON MICROSCOPECHEN Chih; Tu King-Ning
25-十月-2012STRUCTURE FOR MEASURING BUMP RESISTANCE AND PACKAGE SUBSTRATE COMPRISING THE SAMECHEN Chih; Chang Yuan-Wei
顯示 1 到 10 筆資料，總共 10 筆