1. 目前位置：

瀏覽 的方式： 作者 Chang, Chi-Chung

跳到： 0-9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
或是輸入前幾個字：  
顯示 1 到 5 筆資料，總共 5 筆
公開日期標題作者
2014Advanced Crystal Component Package with Silicon TSV Interposer Using 3D Integration and Novel SU-8 Polymer Sealing Bonding StructureShih, Jian-Yu; Chen, Yen-Chi; Lee, Shih-Wei; Hu, Yu-Chen; Chiu, Chih-Hung; Lo, Chung-Lun; Chang, Chi-Chung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-八月-2013Advanced TSV-Based Crystal Resonator Devices Using 3-D Integration Scheme With Hermetic SealingShih, Jian-Yu; Chen, Yen-Chi; Chiu, Chih-Hung; Hu, Yu-Chen; Lo, Chung-Lun; Chang, Chi-Chung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-三月-2015Device Characteristics of TSV-Based Piezoelectric Resonator With Load Capacitance and Static Capacitance ModificationShih, Jian-Yu; Chen, Yen-Chi; Chiu, Chih-Hung; Lo, Chung-Lun; Chang, Chi-Chung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-十月-2014Quartz resonator assembling with TSV interposer using polymer sealing or metal bondingShih, Jian-Yu; Chen, Yen-Chi; Chiu, Chih-Hung; Lo, Chung-Lun; Chang, Chi-Chung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2013TSV-Based Quartz Crystal Resonator Using 3D Integration and Si Packaging TechnologiesShih, Jian-Yu; Chen, Yen-Chi; Chiang, Cheng-Hao; Chiu, Chih-Hung; Hu, Yu-Chen; Lo, Chung-Lun; Chang, Chi-Chung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
顯示 1 到 5 筆資料，總共 5 筆