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公開日期標題作者
1-四月-2017An Advanced 2.5-D Heterogeneous Integration Packaging for High-Density Neural Sensing MicrosystemHu, Yu-Chen; Huang, Yu-Chieh; Huang, Po-Tsang; Wu, Shang-Lin; Chang, Hsiao-Chun; Yang, Yu-Tao; You, Yan-Huei; Chen, Jr-Ming; Huang, Yan-Yu; Lin, Yen-Han; Duann, Jeng-Ren; Chiu, Tzai-Wen; Hwang, Wei; Chuang, Ching-Te; Chiou, Jin-Chern; Chen, Kuan-Neng; 生物科技學系; 電子工程學系及電子研究所; 電控工程研究所; Department of Biological Science and Technology; Department of Electronics Engineering and Institute of Electronics; Institute of Electrical and Control Engineering
1-一月-2016An Advanced 3D/2.5D Integration Packaging Approach Using Double-Self-Assembly Method with Complex Topography, and Micropin-Fin Heat Sink Interposer for Pressure Sensing SystemHu, Yu-Chen; Lin, Chun-Pin; Chang, Hsiao-Chun; Yang, Yu-Tao; Chen, Chi-Shi; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2016Integration of Neural Sensing Microsystem with TSV-embedded Dissolvable mu-Needles Array, Biocompatible Flexible Interposer, and Neural Recording CircuitsHuang, Yu-Chieh; Hu, Yu-Chen; Huang, Po-Tsang; Wu, Shang-Lin; You, Yan-Huei; Chen, Jr-Ming; Huang, Yan-Yu; Chang, Hsiao-Chun; Lin, Yen-Han; Duann, Jeng-Ren; Chiu, Tzai-Wen; Hwang, Wei; Chuang, Ching-Te; Chiou, Jin-Chern; Chen, Kuan-Neng; 交大名義發表; National Chiao Tung University
2015Study of Self-Assembly Technology for 3D Integration ApplicationsChang, Hsiao-Chun; Fan, Cheng-Han; Chou, Yi-Chia; Chen, Kuan-Neng; 電子物理學系; 電子工程學系及電子研究所; Department of Electrophysics; Department of Electronics Engineering and Institute of Electronics
2016An Ultra-High-Density 256-channel/25mm(2) Neural Sensing Microsystem using TSV-embedded Neural ProbesHuang, Yu-Chieh; Huang, Po-Tsang; Wu, Shang-Lin; Hui, Yu-Chen; You, Yan-Huei; Chen, Jr-Ming; Huang, Yan-Yu; Chang, Hsiao-Chun; Lin, Yen-Han; Duann, Jeng-Ren; Chiu, Tzai-Wen; Hwang, Wei; Chen, Kuan-Neng; Chuang, Ching-Te; Chiou, Jin-Chern; 生物科技學系; 電子工程學系及電子研究所; 電機工程學系; 電控工程研究所; Department of Biological Science and Technology; Department of Electronics Engineering and Institute of Electronics; Department of Electrical and Computer Engineering; Institute of Electrical and Control Engineering
1-十月-2017Ultrahigh-Density 256-Channel Neural Sensing Microsystem Using TSV-Embedded Neural ProbesHuang, Yu-Chieh; Huang, Po-Tsang; Wu, Shang-Lin; Hu, Yu-Chen; You, Yan-Huei; Chen, Jr-Ming; Huang, Yan-Yu; Chang, Hsiao-Chun; Lin, Yen-Han; Duann, Jeng-Ren; Chiu, Tzai-Wen; Hwang, Wei; Chen, Kuan-Neng; Chuang, Ching-Te; Chiou, Jin-Chern; 生物科技學系; 電子工程學系及電子研究所; 電機工程學系; 電控工程研究所; Department of Biological Science and Technology; Department of Electronics Engineering and Institute of Electronics; Department of Electrical and Computer Engineering; Institute of Electrical and Control Engineering
1-二月-2018Uneven-Topography-Chip Packing Approach Using Double-Self-Assembly Technology for 3-D Heterogeneous IntegrationShen, Wen-Wei; Chang, Hsiao-Chun; Yang, Yu-Tao; Hu, Yu-Chen; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2016利用雙重自我組裝技術於微電機及生醫系統應用之非平整表面晶片三維異質整合研究張筱君; 陳冠能; Chang, Hsiao-Chun; Chen, Kuan-Neng; 電子研究所
2011農業體驗遊程之遊客滿意度及消費行為：以新埔鎮金漢柿餅教育園區為例張筱君; Chang, Hsiao-Chun; 林崇偉; Lin, Chong-Wei; 客家文化學院客家社會與文化學程
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