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公開日期標題作者
1-九月-2006DC-balance low-jitter transmission code for 4-PAM-signalingChen, Hsiao-Yun; Lin, Chih-Hsien; Jou, Shyh-Jye; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-二月-2008Effect of polyethylene glycol additives on pulse electroplating of SnAg solderChen, Hsiao-Yun; Chen, Chih; Wu, Pu-Wei; Shieh, Jia-Min; Cheng, Shing-Song; Hensen, Karl; 材料科學與工程學系; Department of Materials Science and Engineering
2015Electromigration Immortality of Purely Intermetallic Micro -bump for 3D IntegrationChen, Hsiao-Yun; Tung, Chih-Hang; Hsiao, Yi-Li; Wu, Jyun-lin; Yeh, Tung-Ching; Lin, Larry Liang-Chen; Chen, Chih; Yu, Douglas Cheng-Hua; 材料科學與工程學系; Department of Materials Science and Engineering
2008Enhancing Sn-Ag Solder Joints Electromigration Lifetime via the Under-Bump-Metallization Structure DesignChen, Hsiao-Yun; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
22-九月-2008Failure induced by thermomigration of interstitial Cu in Pb-free flip chip solder jointsChen, Hsiao-Yun; Chen, Chih; Tu, King-Ning; 材料科學與工程學系; Department of Materials Science and Engineering
2013Generic Rules to Achieve Bump Electromigration Immortality for 3D IC IntegrationChen, Hsiao-Yun; Shih, Da-Yuan; Wei, Cheng-Chang; Tung, Chih-Hang; Hsiao, Yi-Li; Yu, Douglas Cheng-Hua; Liang, Yu-Chun; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
2009In-situ Observation of the Failure Induced by Thermomigration of Interstitial Cu in Pb-free Flip Chip Solder JointsChen, Hsiao-Yun; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
1-二月-2009Interfacial Reaction Between Eutectic Sn-Pb Solder and Electroplated-Ni as well as Electroless-Ni Metallization During ReflowChen, Hsiao-Yun; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
2008Kinetic study of eutectic Sn-3.5Ag and Electroplated Ni metallization in flip-chip solder jointsChen, Hsiao-Yun; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
1-四月-2012Kinetic study of the intermetallic compound formation between eutectic Sn-3.5Ag alloys and electroplated Ni metallization in flip-chip solder jointsChen, Hsiao-Yun; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
1-十月-2013A Low-Overhead Interference Canceller for High-Mobility STBC-OFDM SystemsChen, Hsiao-Yun; Chang, Wei-Kai; Jou, Shyh-Jye; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-九月-2010Measurement of electromigration activation energy in eutectic SnPb and SnAg flip-chip solder joints with Cu and Ni under-bump metallizationChen, Hsiao-Yun; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
18-八月-2017Musashi-1 Enhances Glioblastoma Cell Migration and Cytoskeletal Dynamics through Translational Inhibition of Tensin3Chen, Hsiao-Yun; Lin, Liang-Ting; Wang, Mong-Lien; Laurent, Benoit; Hsu, Chih-Hung; Pan, Chih-Ming; Jiang, Wan-Ru; Chen, Pau-Yuan; Ma, Hsin-I; Chen, Yi-Wei; Huang, Pin-I; Chiou, Arthur; Chiou, Shih-Hwa; 分子醫學與生物工程研究所; Institute of Molecular Medicine and Bioengineering
2009Novel FFT Processor with Parallel-In-Parallel-Out in Normal OrderHu, Hsiang-Sheng; Chen, Hsiao-Yun; Jou, Shyh-Jye; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2007Novel programmable FIR filter based on higher radix recoding for low-power and high-performance applicationsChen, Hsiao-Yun; Jou, Shyh-Jye; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-四月-2010A Robust Channel Estimator for High-Mobility STBC-OFDM SystemsChen, Hsiao-Yun; Ku, Meng-Lin; Jou, Shyh-Jye; Huang, Chia-Chi; 電機工程學系; 電信工程研究所; Department of Electrical and Computer Engineering; Institute of Communications Engineering
1-一月-2013STBC-OFDM Downlink Baseband Receiver for Mobile WMANChen, Hsiao-Yun; Lin, Jyun-Nan; Hu, Hsiang-Sheng; Jou, Shyh-Jye; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2008Symbol and carrier frequency offset synchronization for IEEE802.16eLin, Jyun-Nan; Chen, Hsiao-Yun; Wei, Ting-Chen; Jou, Shyh-Jye; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-四月-2011Thermomigration of Cu-Sn and Ni-Sn intermetallic compounds during electromigration in Pb-free SnAg solder jointsChen, Hsiao-Yun; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
1-五月-2012Thermomigration of Ti in flip-chip solder jointsChen, Hsiao-Yun; Lin, Han-Wen; Liu, Chien-Min; Chang, Yuan-Wei; Huang, Annie T.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
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