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顯示 1 到 8 筆資料，總共 8 筆
公開日期標題作者
1-三月-2013Backside-Process-Induced Junction Leakage and Process Improvement of Cu TSV Based on Cu/Sn and BCB Hybrid BondingChang, Yao-Jen; Ko, Cheng-Ta; Yu, Tsung-Han; Chiang, Cheng-Hao; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2013Electrical Investigation and Reliability of 3D Integration Platform using Cu TSVs and Micro-Bumps with Cu/Sn-BCB Hybrid BondingChang, Yao-Jen; Ko, Cheng-Ta; Hsiao, Zhi-Cheng; Chiang, Cheng-Hao; Fu, Huan-Chun; Yu, Tsung-Han; Fan, Cheng-Han; Lo, Wei-Chung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2012Investigation of ICP Parameters for Smooth TSVs and Following Cu Plating Process in 3D IntegrationChiang, Cheng-Hao; Hu, Yu-Chen; Chen, Kuo-Hua; Chiu, Chi-Tsung; Chuang, Ching-Te; Hwang, Wei; Chiou, Jin-Chern; Tong, Ho-Ming; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2012Micro-masking Removal of TSV and Cavity during ICP Etching Using Parameter Control in 3D and MEMS IntegrationsHu, Yu-Chen; Chiang, Cheng-Hao; Chen, Kuo-Hua; Chiu, Chi-Tsung; Chuang, Ching-Te; Hwang, Wei; Chiou, Jin-Chern; Tong, Ho-Ming; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-五月-2013Sealing Bump With Bottom-Up Cu TSV Plating Fabrication in 3-D Integration SchemeChiang, Cheng-Hao; Kuo, Li-Min; Hu, Yu-Chen; Huang, Wen-Chun; Ko, Cheng-Ta; Chen, Kuan-Neng; 電子物理學系; 電子工程學系及電子研究所; Department of Electrophysics; Department of Electronics Engineering and Institute of Electronics
1-二月-2014A TSV-Based Bio-Signal Package With mu-Probe ArrayChou, Lei-Chun; Lee, Shih-Wei; Huang, Po-Tsang; Chang, Chih-Wei; Chiang, Cheng-Hao; Wu, Shang-Lin; Chuang, Ching-Te; Chiou, Jin-Chern; Hwang, Wei; Wu, Chung-Hsi; Chen, Kuo-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; Chen, Kuan-Neng; 交大名義發表; National Chiao Tung University
1-一月-2014A TSV-Based Heterogeneous Integrated Neural-Signal Recording Device with Microprobe ArrayChou, Lei-Chun; Lee, Shih-Wei; Cheng, Chuan-An; Huang, Po-Tsang; Chang, Chih-Wei; Chiang, Cheng-Hao; Wu, Shang-Lin; Chuang, Ching-Te; Chiou, Jin-Chern; Hwang, Wei; Wu, Chung-Hsi; Chen, Kuo-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; Chen, Kuan-Neng; 交大名義發表; National Chiao Tung University
2013TSV-Based Quartz Crystal Resonator Using 3D Integration and Si Packaging TechnologiesShih, Jian-Yu; Chen, Yen-Chi; Chiang, Cheng-Hao; Chiu, Chih-Hung; Hu, Yu-Chen; Lo, Chung-Lun; Chang, Chi-Chung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
顯示 1 到 8 筆資料，總共 8 筆