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公開日期標題作者
1-九月-2006Effect of al trace dimension on electromigration failure time of flip-chip solder jointsChiu, S. H.; Chen, Chih; Yao, D. J.; 材料科學與工程學系; Department of Materials Science and Engineering
19-二月-2007Effect of Al-trace degradation on Joule heating during electromigration in flip-chip solder jointsLiang, S. W.; Chiu, S. H.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
16-五月-2011Effect of Si-die dimensions on electromigration failure time of flip-chip solder jointsChang, Y. W.; Chiu, S. H.; Chen, Chih; Yao, D. J.; 材料科學與工程學系; Department of Materials Science and Engineering
2007Effects of current crowding and Joule heating on reliability of solder jointsLiang, S. W.; Chiu, S. H.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
2014Excellent Color Rendering Index Quantum Dots White Light-Emitting Diode with Distributed Bragg Reflector StructureChen, K. J.; Lin, B. C.; Han, H. V.; Lin, C. C.; Lee, C. Y.; Chien, S. H.; Wang, K. Y.; Chiu, S. H.; Chen, T. M.; Shih, M. H.; Kuo, H. C.; Wang, S. C.; 光電系統研究所; 應用化學系; 應用化學系分子科學碩博班; 光電工程學系; Institute of Photonic System; Department of Applied Chemistry; Institute of Molecular science; Department of Photonics
2015Hybrid White Light-emitting Diodes by Organic-Inorganic materialsChen, K. J.; Lai, Y. C.; Lin, B. C.; Lin, C. C.; Chiu, S. H.; Tu, Z. Y.; Shih, M. H.; Yu, P.; Lee, P. T.; Li, X.; Meng, H. F.; Chi, G. C.; Chen, T. M.; Kuo, H. C.; 光電系統研究所; 應用化學系; 應用化學系分子科學碩博班; 物理研究所; 光電工程學系; Institute of Photonic System; Department of Applied Chemistry; Institute of Molecular science; Institute of Physics; Department of Photonics
25-十二月-2006Investigation of void nucleation and propagation during electromigration of flip-chip solder joints using x-ray microscopyChiu, S. H.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
1-十一月-2010Investigation of Void Nucleation and Propagation in the Joule Heating Effect During Electromigration in Flip-Chip Solder JointsChang, Y. W.; Chiu, S. H.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
2006Joule heating effect under accelerated electromigration in flip-chip solder jointsChiu, S. H.; Liang, S. W.; Chen, Chili; Yao, D. J.; 材料科學與工程學系; Department of Materials Science and Engineering
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