標題: | Joule heating effect under accelerated electromigration in flip-chip solder joints |
作者: | Chiu, S. H. Liang, S. W. Chen, Chili Yao, D. J. 材料科學與工程學系 Department of Materials Science and Engineering |
公開日期: | 2006 |
摘要: | This study employs three-dimensional simulation to investigate the Joule heating effect under accelerated electromigration tests in flip-chip solder joints. It was found that the Joule heating effect was very seriously during high current stressing, and a hot spot exists in the solder bump. The hot-spot may play important role in the void formation and thermomigration in solder bumps during electromigration. |
URI: | http://hdl.handle.net/11536/17333 http://dx.doi.org/10.1109/ECTC.2006.1645721 |
ISBN: | 1-4244-0151-8 |
ISSN: | 0569-5503 |
DOI: | 10.1109/ECTC.2006.1645721 |
期刊: | 56th Electronic Components & Technology Conference 2006, Vol 1 and 2, Proceedings |
起始頁: | 663 |
結束頁: | 666 |
顯示於類別: | 會議論文 |