Joule heating effect under accelerated electromigration in flip-chip solder joints

標題:	Joule heating effect under accelerated electromigration in flip-chip solder joints
作者:	Chiu, S. H. Liang, S. W. Chen, Chili Yao, D. J. 材料科學與工程學系 Department of Materials Science and Engineering
公開日期:	2006
摘要:	This study employs three-dimensional simulation to investigate the Joule heating effect under accelerated electromigration tests in flip-chip solder joints. It was found that the Joule heating effect was very seriously during high current stressing, and a hot spot exists in the solder bump. The hot-spot may play important role in the void formation and thermomigration in solder bumps during electromigration.
URI:	http://hdl.handle.net/11536/17333 http://dx.doi.org/10.1109/ECTC.2006.1645721
ISBN:	1-4244-0151-8
ISSN:	0569-5503
DOI:	10.1109/ECTC.2006.1645721
期刊:	56th Electronic Components & Technology Conference 2006, Vol 1 and 2, Proceedings
起始頁:	663
結束頁:	666
顯示於類別：	會議論文

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