| 標題: | Joule heating effect under accelerated electromigration in flip-chip solder joints |
| 作者: | Chiu, S. H. Liang, S. W. Chen, Chili Yao, D. J. 材料科學與工程學系 Department of Materials Science and Engineering |
| 公開日期: | 2006 |
| 摘要: | This study employs three-dimensional simulation to investigate the Joule heating effect under accelerated electromigration tests in flip-chip solder joints. It was found that the Joule heating effect was very seriously during high current stressing, and a hot spot exists in the solder bump. The hot-spot may play important role in the void formation and thermomigration in solder bumps during electromigration. |
| URI: | http://hdl.handle.net/11536/17333 http://dx.doi.org/10.1109/ECTC.2006.1645721 |
| ISBN: | 1-4244-0151-8 |
| ISSN: | 0569-5503 |
| DOI: | 10.1109/ECTC.2006.1645721 |
| 期刊: | 56th Electronic Components & Technology Conference 2006, Vol 1 and 2, Proceedings |
| 起始頁: | 663 |
| 結束頁: | 666 |
| Appears in Collections: | Conferences Paper |
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- Effects of current crowding and Joule heating on reliability of solder joints / Liang, S. W.;Chiu, S. H.;Chen, Chih
- INVESTIGATION OF JOULE HEATING EFFECT IN VARIOUS STAGES OF FAILURE IN FLIP-CHIP SOLDER JOINTS UNDER ACCELERATED ELECTROMIGRATION / Hsiao, Hsiang Yao;Chen, Chih;Yao, D. J.
- 覆晶銲錫接點在通電下焦耳熱效應及熱遷移之研究 / 蕭翔耀;Hsiao, Hsiang-Yao;陳智;Chen, Chih
- Effect of al trace dimension on electromigration failure time of flip-chip solder joints / Chiu, S. H.;Chen, Chih;Yao, D. J.
- Effect of Al-trace degradation on Joule heating during electromigration in flip-chip solder joints / Liang, S. W.;Chiu, S. H.;Chen, Chih
- Effect of Al-trace dimension on Joule heating and current crowding in flip-chip solder joints under accelerated electromigration / Liang, SW;Chang, YW;Chen, C
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