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Showing results 1 to 18 of 18
Issue DateTitleAuthor(s)
1-Jan-2008Dielectric anisotropy in the integration of Cu-SiLK (TM) systemTseng, Hal-Sin; Chiou, Bi-Shiou; Wu, Wen-Fa; Ho, Chia-Cheng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Feb-2007Effect of plasma treatment on the microstructure and electrical properties of MIM capacitors with PECVD silicon oxide and silicon nitrideHo, Chia-Cheng; Chiou, Bi-Shiou; 電子工程學系及電子研究所; Innovative Packaging Research Center; Department of Electronics Engineering and Institute of Electronics; Innovative Packaging Research Center
1-Jan-2008Effect of size and plasma treatment and the application of Weibull distribution on the breakdown of PECVD SiNx MIM capacitorsHo, Chia-Cheng; Chiou, Bi-Shiou; 電子工程學系及電子研究所; Innovative Packaging Research Center; Department of Electronics Engineering and Institute of Electronics; Innovative Packaging Research Center
1-Mar-2011Effect of Top Electrode Materials on the Nonvolatile Resistive Switching Characteristics of CCTO FilmsLin, Chun-Chieh; Chang, Yi-Peng; Ho, Chia-Cheng; Shen, Yu-Shu; Chiou, Bi-Shiou; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Dec-2008Effects of annealing temperature on the resistance switching behavior of CaCu(3)Ti(4)O(12) filmsShen, Yu-Shu; Chiou, Bi-Shiou; Ho, Chia-Cheng; 電子工程學系及電子研究所; Innovative Packaging Research Center; Department of Electronics Engineering and Institute of Electronics; Innovative Packaging Research Center
1-Dec-2008Effects of annealing temperature on the resistance switching behavior of CaCu3Ti4O12 filmsShen, Yu-Shu; Chiou, Bi-Shiou; Ho, Chia-Cheng; 電子工程學系及電子研究所; Innovative Packaging Research Center; Department of Electronics Engineering and Institute of Electronics; Innovative Packaging Research Center
1-Apr-2007Effects of plasma treatment on the high frequency characteristics of Cu/Ta/hydrogen silsesquioxane (HSQ) system and electrical behaviors of Cu/Ta/HSQ/Pt MIM capacitorsHo, Chia-Cheng; Chiou, Bi-Shiou; 電子工程學系及電子研究所; Innovative Packaging Research Center; Department of Electronics Engineering and Institute of Electronics; Innovative Packaging Research Center
1-Jan-2009Impedance Spectroscopy of CaCu(3)Ti(4)O(12) Films Showing Resistive SwitchingShen, Yu-Shu; Ho, Chia-Cheng; Chiou, Bi-Shiou; 電子工程學系及電子研究所; Innovative Packaging Research Center; Department of Electronics Engineering and Institute of Electronics; Innovative Packaging Research Center
1-Jan-2009Impedance Spectroscopy of CaCu3Ti4O12 Films Showing Resistive SwitchingShen, Yu-Shu; Ho, Chia-Cheng; Chiou, Bi-Shiou; 電子工程學系及電子研究所; Innovative Packaging Research Center; Department of Electronics Engineering and Institute of Electronics; Innovative Packaging Research Center
1-Jul-2008Improvement of electrical properties of Ba(0.7)Sr(0.3)TiO(3) capacitors with an inserted nano-Cr interlayerHo, Chia-Cheng; Chiou, Bi-Shiou; Chang, Li-Chun; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Mar-2010Managing News Coverage around Initial Public OfferingsHo, Chia-Cheng; Huang, Chi-Ling; Lin, Chien-Ting; Lin, George Y. C.; 資訊管理與財務金融系 註：原資管所+財金所; Department of Information Management and Finance
15-Dec-2007Microstructure evolution and dielectric properties of Ba0.7Sr0.3TiO3 parallel plate capacitor with Cr interlayerHo, Chia-Cheng; Chiou, Bi-Shiou; Chang, Li-Chun; 電子工程學系及電子研究所; Innovative Packaging Research Center; Department of Electronics Engineering and Institute of Electronics; Innovative Packaging Research Center
2007Reliability analysis using Weibull distribution on the breakdown of MIM capacitorsHo, Chia-Cheng; Chiou, Bi-Shiou; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2007S-parameters-based high speed signal characterization of Al and Cu interconnect on low-K hydrogen silsesquioxane-Si substrateHo, Chia-Cheng; Chiou, Bi-Shiou; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2007Study on the voltage-controlled-oscillator circuit implemented with Al/HfO2/Si capacitorsPan, Tsai-Sheng; Chang, Li-Chun; Ho, Chia-Cheng; Chiou, Bi-Shiou; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
20-Dec-2006Thermal stability and electric properties of Ba0.7Sr0.3TiO3 parallel plate capacitor with nano-Cr interlayerHo, Chia-Cheng; Chiou, Bi-Shiou; Chang, Li-Chun; Chou, Chen-Chia; Liou, Bo-Heng; Yu, Chin-Chieh; 電子工程學系及電子研究所; Innovative Packaging Research Center; Department of Electronics Engineering and Institute of Electronics; Innovative Packaging Research Center
26-Mar-2007Thickness effects on the electrical characteristics of Ba0.7Sr0.3TiO3 capacitors with nano-Cr interlayerHo, Chia-Cheng; Chiou, Bi-Shiou; Chang, Li-Chun; 電子工程學系及電子研究所; Innovative Packaging Research Center; Department of Electronics Engineering and Institute of Electronics; Innovative Packaging Research Center
3-Dec-2007Thickness-dependent microstructures and electrical properties of CaCu3Ti4O12 films derived from sol-gel processChang, Li-Chun; Lee, Dai-Ying; Ho, Chia-Cheng; Chiou, Bi-Shiou; 電子工程學系及電子研究所; Innovative Packaging Research Center; Department of Electronics Engineering and Institute of Electronics; Innovative Packaging Research Center
Showing results 1 to 18 of 18