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公開日期標題作者
13-九月-2002Caspase activation of mammalian Sterile 20-like kinase 3 (Mst3) - Nuclear translocation and induction of apoptosisHuang, CYF; Wu, YM; Hsu, CY; Lee, WS; Lai, MD; Lu, TJ; Huang, CL; Leu, TH; Shih, HM; Fang, HI; Robinson, DR; Kung, HJ; Yuan, CJ; 生物科技學系; Department of Biological Science and Technology
2005Decision feedback IBI mitigation in OFDM systemsWu, WR; Hsu, CY; 電信工程研究所; Institute of Communications Engineering
22-九月-2003Effect of thermal annealing of Ni/Au ohmic contact on the leakage current of GaN based light emitting diodesHsu, CY; Lan, WH; Wu, YS; 材料科學與工程學系; Department of Materials Science and Engineering
2003An efficient IP-Level power model for complex digital circuitsHsu, CY; Liu, CNJ; Jou, JY; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-八月-2003An efficient power model for IP-level complex designsHsu, CY; Liu, CNJ; Jou, JY; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-十一月-2004Efficient vector compaction methods for power estimation with consecutive sampling techniquesHsu, CY; Liu, CNJ; Jou, JY; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-十月-2003GaN-based light-emitting diodes with Ni/AuBe transparent conductive layerChen, LC; Hsu, CY; Lan, WH; Teng, SY; 材料科學與工程學系; Department of Materials Science and Engineering
13-八月-2004Identification and characterization of the nuclear import and export signals of the mammalian Ste20-like protein kinase 3Lee, WS; Hsu, CY; Wang, PL; Huang, CYF; Chang, CH; Yuan, CJ; 生物科技學系; Department of Biological Science and Technology
2003Improved vector compaction for power estimation with multi-sequence sampling techniqueHsu, CY; Liu, CNJ; Jou, JY; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2006The influences of contact interfaces between the indium tin oxide-based contact layer and GaN-based LEDsHsu, CY; Lan, WH; Wu, YCS; 材料科學與工程學系; Department of Materials Science and Engineering
9-一月-2006Infrared microscopy of hot spots induced by Joule heating in flip-chip SnAg solder joints under accelerated electromigrationChiu, SH; Shao, TL; Chen, C; Yao, DJ; Hsu, CY; 材料科學與工程學系; Department of Materials Science and Engineering
2005ISI mitigation and channel tracking in MIMO-OFDM systemsWu, WR; Hsu, CY; Hsu, HT; 電信工程研究所; Institute of Communications Engineering
2004Project-based knowledge maps: combining project mining and XML-enabled topic mapsLiu, DR; Hsu, CY; 資訊管理與財務金融系 註:原資管所+財金所; Department of Information Management and Finance
7-三月-2001The role of mammalian Ste20-like kinase MST3 in apoptosisYuan, CJ; Hsu, CY; Huang, CYF; 交大名義發表; National Chiao Tung University
1-五月-2006Temperature and current-density distributions in flip-chip solder joints with Cu tracesHsu, CY; Yao, DJ; Liang, SW; Chen, C; Yeh, ECC; 材料科學與工程學系; Department of Materials Science and Engineering
1-十月-2005Thermal annealing effect of indium tin oxide contact to GaN light-emitting diodesHsu, CY; Lan, WH; Wu, YCS; 材料科學與工程學系; Department of Materials Science and Engineering
1-十一月-2004Thermal gradient in solder joints under electrical-current stressingShao, TL; Chiu, SH; Chen, C; Yao, DJ; Hsu, CY; 材料科學與工程學系; Department of Materials Science and Engineering
12-七月-2005Ultrafine platinum nanoparticles uniformly dispersed on arrayed CNx nanotubes with high electrochemical activitySun, CL; Chen, LC; Su, MC; Hong, LS; Chyan, O; Hsu, CY; Chen, KH; Chang, TF; Chang, L; 材料科學與工程學系; Department of Materials Science and Engineering
2002Vector compacation for power estimation with grouping and consecutive sampling techniquesHsu, CY; Shen, WZ; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics