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1-一月-2019Copper direct bonding with short time and excellent electrical property by < 111 >-oriented nano-twinned copperShie, Kai Cheng; Juang, Jing-Ye; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
1-一月-2017Copper-to-Copper direct bonding on highly (111) oriented nano-twinned copper in no-vacuum ambientJuang, Jing-Ye; Lu, Chia-Ling; Chen, Kuan-Ju; Chang, Tao-Chih; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
17-九月-2018Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambientJuang, Jing-Ye; Lu, Chia-Ling; Chen, Kuan-Ju; Chen, Chao-Chang A.; Hsu, Po-Ning; Chen, Chih; Tu, K. N.; 材料科學與工程學系; Department of Materials Science and Engineering
1-十二月-2018Correlation between the Microstructures of Bonding Interfaces and the Shear Strength of Cu-to-Cu Joints Using (111)-Oriented and Nanotwinned CuJuang, Jing-Ye; Lu, Chia-Ling; Li, Yu-Jin; Tu, K. N.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
1-一月-2014Effect of Joint Shape Controlled by Thermocompression Bonding on the Reliability Performance of 60 mu m-pitch Solder Micro Bump InterconnectionsHuang, Yu-Wei; Zhan, Chau-Jie; Juang, Jing-Ye; Lin Yu-Min; Huang, Shin-Yi; Chen, Su-Mei; Fan, Chia-Wen; Cheng, Ren-Shin; Chao, Shu-Han; Hsieh, Wan-Lin; Chen, Chih; Lau, John H.; 材料科學與工程學系; Department of Materials Science and Engineering
2016Fabrication of (111) nanotwinned Cu and its applications in interconnects of microelectronic devicesChen, Chih; Liu, Chien-Min; Lu, Tien-Lin; Lin, Han-wen; Chu, Yi-Cheng; Lu, Chia-Ling; Juang, Jing-Ye; Chen, Kuan-Neng; Tu, K. N.; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
1-二月-2020Instant Cu-to-Cu direct bonding enabled by < 111 >-oriented nanotwinned Cu bumpsShie, Kai Cheng; Juang, Jing-Ye; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
1-一月-2017Low temperature Cu-Cu direct bonding by (111) oriented nano-twin CuJuang, Jing-Ye; Chu, Yi-Cheng; Lu, Chia-Ling; Chen, Chih; Tu, King-Ning; 材料科學與工程學系; Department of Materials Science and Engineering
1-一月-2019Low-temperature Cu-to-Cu direct bonding enabled by highly (111)-oriented and nanotwinned CuChen, Chih; Juang, Jing-Ye; Chang, Shih Yang; Shie, Kai Cheng; Li, Yu Jin; Tu, K. N.; 材料科學與工程學系; Department of Materials Science and Engineering
12-四月-2018A new failure mechanism of electromigration by surface diffusion of Sn on Ni and Cu metallization in microbumpsChang, Yuan-Wei; Hu, Chia-chia; Peng, Hsin-Ying; Liang, Yu-Chun; Chen, Chih; Chang, Tao-chih; Zhan, Chau-Jie; Juang, Jing-Ye; 材料科學與工程學系; Department of Materials Science and Engineering
顯示 1 到 10 筆資料，總共 10 筆