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Browsing by Author Lin, Han-Wen

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Showing results 1 to 11 of 11
Issue DateTitleAuthor(s)
19-Aug-2014Effect of grain orientations of Cu seed layers on the growth of < 111 >-oriented nanotwinned CuLiu, Chien-Min; Lin, Han-Wen; Lu, Chia-Ling; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
2016Electromigration in microbumps with Cu-Sn intermetallic compoundsChu, Yi-Cheng; Zhan, Chau-Jie; Lin, Han-Wen; Huang, Yu-Wei; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
1-Oct-2014Extremely anisotropic single-crystal growth in nanotwinned copperLu, Chia-Ling; Lin, Han-Wen; Liu, Chien-Min; Huang, Yi-Sa; Lu, Tien-Lin; Liu, Tao-Chi; Hsiao, Hsiang-Yao; Chen, Chih; Kuo, Jui-Chao; Tu, King-Ning; 材料科學與工程學系; Department of Materials Science and Engineering
2015Fabrication of arrays of (100) Cu under-bump-metallization for 3D IC packagingChiu, Wei-Lan; Lu, Chia-Ling; Lin, Han-Wen; Liu, Chien-Min; Huang, Yi-Sa; Lu, Tien-Lin; Liu, Tao-Chi; Hsiao, Hsiang-Yao; Chen, Chih; Kuo, Jui-Chao; Tu, King-Ning; 材料科學與工程學系; Department of Materials Science and Engineering
2016LOW-TEMPERATURE AND LOW-PRESSURE DIRECT COPPER-TO-COPPER BONDING BY HIGHLY (111)-ORIENTED NANOTWINNED CUChen, Chih; Liu, Chien-Min; Lin, Han-Wen; Huang, Yi-Sa; Chu, Yi-Cheng; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, K. N.; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
12-May-2015Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned CuLiu, Chien-Min; Lin, Han-Wen; Huang, Yi-Sa; Chu, Yi-Cheng; Chen, Chih; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, King-Ning; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
1-May-2014Low-temperature direct copper-to-copper bonding enabled by creep on highly (111)-oriented Cu surfacesLiu, Chien-Min; Lin, Han-Wen; Chu, Yi-Cheng; Chen, Chih; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, K. N.; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
1-Dec-2012Novel EBSD preparation method for Cu/Sn microbumps using a focused ion beamLiu, Tao-Chi; Chen, Chih; Chiu, Kuo-Jung; Lin, Han-Wen; Kuo, Jui-Chao; 材料科學與工程學系; Department of Materials Science and Engineering
1-May-2012Thermomigration of Ti in flip-chip solder jointsChen, Hsiao-Yun; Lin, Han-Wen; Liu, Chien-Min; Chang, Yuan-Wei; Huang, Annie T.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
25-May-2012Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned CopperHsiao, Hsiang-Yao; Liu, Chien-Min; Lin, Han-Wen; Liu, Tao-Chi; Lu, Chia-Ling; Huang, Yi-Sa; Chen, Chih; Tu, K. N.; 材料科學與工程學系; Department of Materials Science and Engineering
2013以控制銅錫介金屬化合物的晶體方向與形貌改善微電子封裝可靠度之研究林漢文; Lin, Han-Wen; 陳智; Chen, Chih; 材料科學與工程學系所
Showing results 1 to 11 of 11