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Browsing by Author Lo, Chung-Lun

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Showing results 1 to 6 of 6
Issue DateTitleAuthor(s)
2014Advanced Crystal Component Package with Silicon TSV Interposer Using 3D Integration and Novel SU-8 Polymer Sealing Bonding StructureShih, Jian-Yu; Chen, Yen-Chi; Lee, Shih-Wei; Hu, Yu-Chen; Chiu, Chih-Hung; Lo, Chung-Lun; Chang, Chi-Chung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Aug-2013Advanced TSV-Based Crystal Resonator Devices Using 3-D Integration Scheme With Hermetic SealingShih, Jian-Yu; Chen, Yen-Chi; Chiu, Chih-Hung; Hu, Yu-Chen; Lo, Chung-Lun; Chang, Chi-Chung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Mar-2015Device Characteristics of TSV-Based Piezoelectric Resonator With Load Capacitance and Static Capacitance ModificationShih, Jian-Yu; Chen, Yen-Chi; Chiu, Chih-Hung; Lo, Chung-Lun; Chang, Chi-Chung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jan-2014A Novel Si-based X'tal Oscillator Device Using 3D Integration TechnologiesShih, Jian-Yu; Chen, Yen-Chi; Chiu, Chih-Hung; Lo, Chung-Lun; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Oct-2014Quartz resonator assembling with TSV interposer using polymer sealing or metal bondingShih, Jian-Yu; Chen, Yen-Chi; Chiu, Chih-Hung; Lo, Chung-Lun; Chang, Chi-Chung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2013TSV-Based Quartz Crystal Resonator Using 3D Integration and Si Packaging TechnologiesShih, Jian-Yu; Chen, Yen-Chi; Chiang, Cheng-Hao; Chiu, Chih-Hung; Hu, Yu-Chen; Lo, Chung-Lun; Chang, Chi-Chung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
Showing results 1 to 6 of 6