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顯示 1 到 12 筆資料，總共 12 筆
公開日期標題作者
1-一月-2010An 80 nm In(0.7)Ga(0.3)As MHEMT with Flip-Chip Packaging for W-Band Low Noise ApplicationsWang, Chin-Te; Kuo, Chien-I; Lim, Wee-Chin; Hsu, Li-Han; Hsu, Heng-Tung; Miyamoto, Yasuyuki; Chang, Edward Yi; Tsai, Szu-Ping; Chiu, Yu-Sheng; 材料科學與工程學系; Department of Materials Science and Engineering
1-一月-2010An 80 nm In0.7Ga0.3As MHEMT with Flip-Chip Packaging for W-Band Low Noise ApplicationsWang, Chin-Te; Kuo, Chien-, I; Lim, Wee-Chin; Hsu, Li-Han; Hsu, Heng-Tung; Miyamoto, Yasuyuki; Chang, Edward Yi; Tsai, Szu-Ping; Chiu, Yu-Sheng; 材料科學與工程學系; Department of Materials Science and Engineering
1-十二月-2013Assessment of Thermal Impact on Performance of Metamorphic High-Electron-Mobility Transistors on Polymer Substrates Using Flip-Chip-on-Board TechnologyWang, Chin-Te; Hsu, Heng-Tung; Chiang, Che-Yang; Chang, Edward Yi; Lim, Wee-Chin; 材料科學與工程學系; Department of Materials Science and Engineering
1-二月-2010Design and Fabrication of 0/1-Level RF-Via Interconnect for RF-MEMS Packaging ApplicationsHsu, Li-Han; Wu, Wei-Cheng; Chang, Edward Yi; Zirath, Herbert; Wu, Yun-Chi; Wang, Chin-Te; Lee, Ching-Ting; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
1-八月-2010Design of Flip-Chip Interconnect Using Epoxy-Based Underfill Up to V-Band Frequencies With Excellent ReliabilityHsu, Li-Han; Wu, Wei-Cheng; Chang, Edward Yi; Zirath, Herbert; Hu, Yin-Chu; Wang, Chin-Te; Wu, Yun-Chi; Tsai, Szu-Ping; 材料科學與工程學系; Department of Materials Science and Engineering
1-三月-2012Design, Fabrication, and Reliability of Low-Cost Flip-Chip-On-Board Package for Commercial Applications up to 50 GHzHsu, Li-Han; Oh, Chee-Way; Wu, Wei-Cheng; Chang, Edward Yi; Zirath, Herbert; Wang, Chin-Te; Tsai, Szu-Ping; Lim, Wee-Chin; Lin, Yueh-Chin; 材料科學與工程學系; Department of Materials Science and Engineering
2010Flip-Chip Packaging of In0.6Ga0.4As MHEMT Device on Low-Cost Organic Substrate for W-Band ApplicationsLim, Wee Chin; Wang, Chin-Te; Kuo, Chien-I; Hsu, Li-Han; Tsai, Szu-Ping; Chang, Edward Yi; 材料科學與工程學系; Department of Materials Science and Engineering
1-九月-2011Flip-Chip Packaging of Low-Noise Metamorphic High Electron Mobility Transistors on Low-Cost Organic SubstrateWang, Chin-Te; Kuo, Chien-I; Hsu, Heng-Tung; Chang, Edward Yi; Hsu, Li-Han; Lim, Wee-Chin; Miyamoto, Yasuyuki; 材料科學與工程學系; Department of Materials Science and Engineering
1-一月-2014Investigation of the Flip-Chip Package With BCB Underfill for W-Band ApplicationsWang, Chin-Te; Hsu, Li-Han; Wu, Wei-Cheng; Hsu, Heng-Tung; Chang, Edward Yi; Hu, Yin-Chu; Lee, Ching-Ting; Tsai, Szu-Ping; 材料科學與工程學系; Department of Materials Science and Engineering
1-十月-2011V-Band Flip-Chip Assembled Gain Block Using In(0.6)Ga(0.4)As Metamorphic High-Electron-Mobility Transistor TechnologyChiang, Che-Yang; Hsu, Heng-Tung; Wang, Chin-Te; Kuo, Chien-I; Hsu, Heng-Shou; Chang, Edward Yi; 材料科學與工程學系; Department of Materials Science and Engineering
1-十月-2011V-Band Flip-Chip Assembled Gain Block Using In0.6Ga0.4As Metamorphic High-Electron-Mobility Transistor TechnologyChiang, Che-Yang; Hsu, Heng-Tung; Wang, Chin-Te; Kuo, Chien-I; Hsu, Heng-Shou; Chang, Edward Yi; 材料科學與工程學系; Department of Materials Science and Engineering
2013應用於毫微米波段高電子遷移率電晶體之覆晶封裝研究王景德; Wang, Chin-Te; 張翼; Chang, Edward Yi; 材料科學與工程學系所
顯示 1 到 12 筆資料，總共 12 筆