標題: | 三維積體電路(3D IC)關鍵技術之研究 Research and Development of Key Technologies for 3D IC |
作者: | 陳冠能 CHEN KUAN-NENG 國立交通大學電子工程學系及電子研究所 |
公開日期: | 2009 |
官方說明文件#: | NSC98-2218-E009-013-MY2 |
URI: | http://hdl.handle.net/11536/101511 https://www.grb.gov.tw/search/planDetail?id=1887448&docId=312128 |
Appears in Collections: | Research Plans |
Files in This Item:
If it is a zip file, please download the file and unzip it, then open index.html in a browser to view the full text content.