| 標題: | 單晶片系統驗證之核心技術開發---子計畫六：針對先進晶片設計的熱點驗證之完整熱模型與高效能熱分析(III) Compact Thermal Modeling and Efficient Thermal Simulation for Hot Spots Verifications of Modern IC Designs(III) |
| 作者: | 李育民 LEE YU-MIN 國立交通大學電信工程學系(所) |
| 公開日期: | 2007 |
| 官方說明文件#: | NSC96-2220-E009-012 |
| URI: | http://hdl.handle.net/11536/102954 https://www.grb.gov.tw/search/planDetail?id=1462772&docId=262096 |
| Appears in Collections: | Research Plans |
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