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dc.contributor.authorChang Edward Yien_US
dc.contributor.authorKuo Chien-Ien_US
dc.contributor.authorHsu Heng-Tungen_US
dc.date.accessioned2014-12-16T06:15:24Z-
dc.date.available2014-12-16T06:15:24Z-
dc.date.issued2011-06-30en_US
dc.identifier.govdocH01L029/778zh_TW
dc.identifier.govdocH01L021/335zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/105287-
dc.description.abstractA high electron mobility transistor includes a substrate, a buffer layer, a channel layer, a spacer layer, a schottky layer and a cap layer. The buffer layer is formed on the substrate. The channel layer is formed on the buffer layer, in which the channel layer comprises a superlattice structure formed with a plurality of indium gallium arsenide thin films alternately stacked with a plurality of indium arsenide thin films. The spacer layer is formed on the channel layer. The schottky layer is formed on the spacer layer. The cap layer is formed on the schottky layer.zh_TW
dc.language.isozh_TWen_US
dc.titleHigh Electron Mobility Transistor and Method for Fabricating the Samezh_TW
dc.typePatentsen_US
dc.citation.patentcountryUSAzh_TW
dc.citation.patentnumber20110156100zh_TW
Appears in Collections:Patents


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