| 標題: | Surface-metallized polyimide material and method for manufacturing the same |
| 作者: | Whang, Wha-tzong Hsiao, Yu-sheng |
| 公開日期: | 11-十月-2007 |
| 摘要: | A method for manufacturing a surface-metallized polyimide material includes performing an alkaline treatment on a surface of a polyimide material to cause ring opening of the polyimide material on the surface; the surface of the polyimide material being subject to an ion exchange process for being displaced by a first metal ion exclusive of palladium ion, gold ion, silver ion, and copper ion; and performing a wet reduction process to reduce the first metal ion on the surface of the polyimide material into a first metal that adheres to the surface of the polyimide material. A surface-metallized polyimide material produced according to the aforementioned method is also disclosed. |
| 官方說明文件#: | H01L021/28 B32B017/06 |
| URI: | http://hdl.handle.net/11536/105632 |
| 專利國: | USA |
| 專利號碼: | 20070237969 |
| 顯示於類別: | 專利資料 |

