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dc.contributor.authorMa, Ming-Wenen_US
dc.contributor.authorWu, Chien-Hungen_US
dc.contributor.authorYang, Tsung-Yuen_US
dc.contributor.authorKao, Kuo-Hsingen_US
dc.contributor.authorWu, Woei-Cherngen_US
dc.contributor.authorWang, Shui-Jinnen_US
dc.contributor.authorChao, Tien-Shengen_US
dc.contributor.authorLei, Tan-Fuen_US
dc.date.accessioned2014-12-08T15:14:34Z-
dc.date.available2014-12-08T15:14:34Z-
dc.date.issued2007-03-01en_US
dc.identifier.issn0741-3106en_US
dc.identifier.urihttp://dx.doi.org/10.1109/LED.2007.891282en_US
dc.identifier.urihttp://hdl.handle.net/11536/11075-
dc.description.abstractIn this letter, 65-nm node silicon-on-insulator devices with high-k, offset spacer dielectric were investigated by extensive 2-D device simulation. The result shows that the high-k, offset spacer dielectric can effectively increase the ON-state driving current I-ON and reduce the OFF leakage current I-OFF due to the high vertical fringing electric field effect. This fringing field can significantly improve the I-ON/I-OFF current ratio and the subthreshold swing compared with the conventional oxide spacer. Consequently, the gate-to-channel control ability is enhanced by the fringing field via the high-k offset spacer dielectric.en_US
dc.language.isoen_USen_US
dc.subjectfringing electric fielden_US
dc.subjecthigh-k offset spacer dielectricen_US
dc.subjectsilicon-on-insulator (SOI)en_US
dc.titleImpact of high-k offset spacer in 65-nm node SOI devicesen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/LED.2007.891282en_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.citation.volume28en_US
dc.citation.issue3en_US
dc.citation.spage238en_US
dc.citation.epage241en_US
dc.contributor.department電子物理學系zh_TW
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electrophysicsen_US
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000245184700017-
dc.citation.woscount7-
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