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dc.contributor.authorChen, Jian Haoen_US
dc.contributor.authorHuang, Tzung Binen_US
dc.contributor.authorWu, Xiaohuaen_US
dc.contributor.authorLandheer, Dolfen_US
dc.contributor.authorLei, Tan Fuen_US
dc.contributor.authorChao, Tien Shengen_US
dc.date.accessioned2014-12-08T15:15:03Z-
dc.date.available2014-12-08T15:15:03Z-
dc.date.issued2007en_US
dc.identifier.issn0013-4651en_US
dc.identifier.urihttp://hdl.handle.net/11536/11327-
dc.identifier.urihttp://dx.doi.org/10.1149/1.2388733en_US
dc.description.abstractIn this paper, three approaches to incorporating nitrogen in CoTiO3 high-k dielectric films, ion implantation of N-2(+), ion implantation of N+, and N2O plasma treatment have been investigated for the new CoTiO3 high-k dielectrics. All three methods reduced the leakage currents and improved the breakdown characteristics but the N2O-plasma treatment produced the best-behaved C-V curves, when compared to the untreated control samples. (c) 2006 The Electrochemical Society.en_US
dc.language.isoen_USen_US
dc.titlePerformance improvement of CoTiO3 high-k dielectrics with nitrogen incorporationen_US
dc.typeArticleen_US
dc.identifier.doi10.1149/1.2388733en_US
dc.identifier.journalJOURNAL OF THE ELECTROCHEMICAL SOCIETYen_US
dc.citation.volume154en_US
dc.citation.issue1en_US
dc.citation.spageG18en_US
dc.citation.epageG23en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000242538600058-
dc.citation.woscount4-
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