標題: | Bond pad design with low capacitance in CMOS technology for RF applications |
作者: | Hsiao, Yuan-Wen Ker, Ming-Dou 電機學院 College of Electrical and Computer Engineering |
關鍵字: | bond pad;capacitance;loss;radio frequency integrated circuit (RF IC) |
公開日期: | 1-一月-2007 |
摘要: | A new bond pad structure in CMOS technology with low capacitance for gigahertz radio frequency applications is proposed. Three kinds of inductors stacked under the pad are used in the proposed bond pad structure. Experimental results have verified that the bond pad capacitance is reduced due to the cancellation effect provided by the inductor embedded in the proposed bond pad structure. The new proposed bond pad structure is fully process-compatible to general CMOS processes without any extra process modification. |
URI: | http://dx.doi.org/10.1109/LED.2006.887631 http://hdl.handle.net/11536/11396 |
ISSN: | 0741-3106 |
DOI: | 10.1109/LED.2006.887631 |
期刊: | IEEE ELECTRON DEVICE LETTERS |
Volume: | 28 |
Issue: | 1 |
起始頁: | 68 |
結束頁: | 70 |
顯示於類別: | 期刊論文 |