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dc.contributor.authorGuo, Jyh-Chyurnen_US
dc.date.accessioned2014-12-08T15:16:10Z-
dc.date.available2014-12-08T15:16:10Z-
dc.date.issued2006-08-01en_US
dc.identifier.issn0894-6507en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TSM.2006.879415en_US
dc.identifier.urihttp://hdl.handle.net/11536/11994-
dc.description.abstractLogic CMOS-based RF technology is introduced for a 10-Gb transceiver in which active and passive RF devices have been realized in a single chip. RF nMOS of 115-GHz f(T), 100-GHz f(max), and sub-1.0-dB NFmin at 10 GHz have been fabricated by aggressive device scaling and layout optimization. High-Q MiM capacitor and spiral Cu inductors have been successfully implemented in the same chip by 0.13-mu m low-K/Cu back end of integration line technology. Core 1.0 V MOS and/or junction varactors for VCO at 10 GHz are offerings free of extra cost and realized by the elaborated layout.en_US
dc.language.isoen_USen_US
dc.subjectf(max)en_US
dc.subjectf(T)en_US
dc.subjectinductoren_US
dc.subjectMiM capacitoren_US
dc.subjectNFminen_US
dc.subjectRF CMOSen_US
dc.subjectvaractoren_US
dc.titleLow-K/Cu CMOS-based SoC technology with 115-GHz f(T), 100-GHz f(max), noise 80-nm RF CMOS, high-Q MiM capacitor, and spiral Cu inductoren_US
dc.typeArticleen_US
dc.identifier.doi10.1109/TSM.2006.879415en_US
dc.identifier.journalIEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURINGen_US
dc.citation.volume19en_US
dc.citation.issue3en_US
dc.citation.spage331en_US
dc.citation.epage338en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000239706300006-
dc.citation.woscount3-
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