標題: | Study of void formation due to electromigration in flip-chip solder joints using Kelvin bump probes |
作者: | Chang, Y. W. Liang, S. W. Chen, Chih 材料科學與工程學系 Department of Materials Science and Engineering |
公開日期: | 17-七月-2006 |
摘要: | Kelvin bump probes were fabricated in flip-chip solder joints, and they were employed to monitor the void formation during electromigration. We found that voids started to form at approximately 5% of the failure time under 0.8 A at 150 degrees C, and the bump resistance increased only 0.02 m Omega in the initial stage of void formation. Three-dimensional simulation was performed to examine the increase in bump resistance at different stages of void formation, and it fitted the experimental results quite well. This technique provides a systematic way for investigating the void formation during electromigration. (c) 2006 American Institute of Physics. |
URI: | http://dx.doi.org/10.1063/1.2226989 http://hdl.handle.net/11536/12020 |
ISSN: | 0003-6951 |
DOI: | 10.1063/1.2226989 |
期刊: | APPLIED PHYSICS LETTERS |
Volume: | 89 |
Issue: | 3 |
結束頁: | |
顯示於類別: | 期刊論文 |