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dc.contributor.authorYu, DSen_US
dc.contributor.authorKao, HLen_US
dc.contributor.authorChin, Aen_US
dc.contributor.authorMcAlister, SPen_US
dc.date.accessioned2014-12-08T15:16:41Z-
dc.date.available2014-12-08T15:16:41Z-
dc.date.issued2006-05-01en_US
dc.identifier.issn0734-2101en_US
dc.identifier.urihttp://dx.doi.org/10.1116/1.2167978en_US
dc.identifier.urihttp://hdl.handle.net/11536/12308-
dc.description.abstractThe performance of field-effect transistors may be improved by increasing the channel mobility. Strained Si can accomplish this but Ge is another option. Here we show data for germanium-on-insulator (GOI) devices and also describe the simple bonding process which was used in the device fabrication. The GOI devices show better mobilities than their Si counterparts. We also show data for some metal-gate/high-kappa dielectric devices on a GOI layer fabricated on a processed Si wafer. Here the GOI structure and processing does not alter the underlying Si devices and yet gives devices whose mobilities exceed those of Si devices. Simulations support the view that the improved performance results from the mobility enhancement and that the performance should also hold for submicron devices. (c) 2006 American Vacuum Society.en_US
dc.language.isoen_USen_US
dc.titlePerformance and potential of germanium on insulator field-effect transistorsen_US
dc.typeArticle; Proceedings Paperen_US
dc.identifier.doi10.1116/1.2167978en_US
dc.identifier.journalJOURNAL OF VACUUM SCIENCE & TECHNOLOGY Aen_US
dc.citation.volume24en_US
dc.citation.issue3en_US
dc.citation.spage690en_US
dc.citation.epage693en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000238091300049-
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