標題: Routability-Driven Bump Assignment for Chip-Package Co-Design
作者: Chen, Meng-Ling
Tsai, Tu-Hsiung
Chen, Hung-Ming
Chen, Shi-Hao
電子工程學系及電子研究所
Department of Electronics Engineering and Institute of Electronics
公開日期: 1-一月-2014
摘要: In current chip and package designs, it is a bottleneck to simultaneously optimize both pin assignment and pin routing for different design domains (chip, package, and board). Usually the whole process costs a huge manual effort and multiple iterations thus reducing profit margin. Therefore, we propose a fast heuristic chip-package co-design algorithm in order to automatically obtain a bump assignment which introduces high routability both in RDL routing and substrate routing (100% in our real case). Experimental results show that the proposed method (inspired by board escape routing algorithms) automatically finishes bump assignment, RDL routing and substrate routing in a short time, while the traditional co-design flow requires weeks even months.
URI: http://hdl.handle.net/11536/125047
ISBN: 978-1-4799-2816-3
ISSN: 2153-6961
期刊: 2014 19TH ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE (ASP-DAC)
起始頁: 519
結束頁: 524
顯示於類別:會議論文