標題: | Routability-Driven Bump Assignment for Chip-Package Co-Design |
作者: | Chen, Meng-Ling Tsai, Tu-Hsiung Chen, Hung-Ming Chen, Shi-Hao 電子工程學系及電子研究所 Department of Electronics Engineering and Institute of Electronics |
公開日期: | 1-一月-2014 |
摘要: | In current chip and package designs, it is a bottleneck to simultaneously optimize both pin assignment and pin routing for different design domains (chip, package, and board). Usually the whole process costs a huge manual effort and multiple iterations thus reducing profit margin. Therefore, we propose a fast heuristic chip-package co-design algorithm in order to automatically obtain a bump assignment which introduces high routability both in RDL routing and substrate routing (100% in our real case). Experimental results show that the proposed method (inspired by board escape routing algorithms) automatically finishes bump assignment, RDL routing and substrate routing in a short time, while the traditional co-design flow requires weeks even months. |
URI: | http://hdl.handle.net/11536/125047 |
ISBN: | 978-1-4799-2816-3 |
ISSN: | 2153-6961 |
期刊: | 2014 19TH ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE (ASP-DAC) |
起始頁: | 519 |
結束頁: | 524 |
顯示於類別: | 會議論文 |