三維積體電路之頻率振盪元件封裝特性與應用

完整後設資料紀錄

DC 欄位	值	語言
dc.contributor.author	施建宇	en_US
dc.contributor.author	Shih, Jian-Yu	en_US
dc.contributor.author	陳冠能	en_US
dc.contributor.author	Chen, Kuan-Neng	en_US
dc.date.accessioned	2015-11-26T00:55:40Z	-
dc.date.available	2015-11-26T00:55:40Z	-
dc.date.issued	2015	en_US
dc.identifier.uri	http://140.113.39.130/cdrfb3/record/nctu/#GT079811540	en_US
dc.identifier.uri	http://hdl.handle.net/11536/125934	-
dc.language.iso	zh_TW	en_US
dc.subject	三維積體電路技術	zh_TW
dc.subject	矽直銅導孔	zh_TW
dc.subject	晶圓級接合	zh_TW
dc.subject	晶圓薄化技術	zh_TW
dc.subject	石英頻率元件	zh_TW
dc.subject	3D integration	en_US
dc.subject	Cu through-silicon-vias	en_US
dc.subject	Wafer level bonding	en_US
dc.subject	wafer thinning techniques	en_US
dc.subject	quartz resonator device	en_US
dc.title	三維積體電路之頻率振盪元件封裝特性與應用	zh_TW
dc.title	Study on Characteristics and Applications of Frequency Resonator Devices with 3D IC Integration	en_US
dc.type	Thesis	en_US
dc.contributor.department	電子工程學系電子研究所	zh_TW
顯示於類別：	畢業論文