超音波輔助玻璃尖端陣列微結構之成形研究

Abstract

本研究之遠程目標為利用超音波輔助玻璃熱壓成形技術製作場發射電極，目前雖然已有超音波輔助玻璃熱壓成形之相關研究，但尚無研究是探討熱壓參數對金字塔微結構陣列成形之影響。 本研究是將超音波輔助技術應用於玻璃尖端微結構之成形上，比較熱壓溫度及熱壓速度對微結構成形的影響，並探討施加35kHZ、振幅4μm之超音波對玻璃熱壓成形之製程參數以及最終熱壓成品之影響。 本研究已成功在K-PSK100平面玻璃試片上成形出尖端微結構陣列，並探討了熱壓參數、平面下模具、凹痕模具及施加超音波輔助成形對尖端微結構陣列成形的影響。

Ultrasonic vibration-assisted hot glass embossing technique is a novel method to produce field emitter electrodes. Although ultrasonic vibration-assisted hot glass embossing process has been studied, effect of process parameters on the filling ability of the glass into the microstructures which shaped as pyramid array has not been carried out so far. Therefore, the purpose of this research is to study effect of ultrasonic vibration on improving filling ability of glass material into the pyramid arrays' structures as well as to carry out the influence of process's parameters on the quality of molded microstructure.This research successfully embossed pyramid arrays’ microstructures on K-PSK100 plate glass specimen using hot embossing process with the assistance of ultrasonic vibration (frequency of 35 kHz, amplitude of 4μm). Furthermore, effect of some parameters such as embossing temperature, embossing speed, lower mold geometry and ultrasonic vibration on the final shape of pyramid microstructures were investigated.