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標題: 三維積體電路與手持裝置之熱分析技術
Thermal Analysis Techniques for 3-D Integrated Circuits and Handheld Devices
作者: 潘麒文
Pan, Chi-Wen
李育民
Lee, Yu-Min
電信工程研究所
關鍵字: 三維積體電路;手持裝置;熱分析;智慧型手機;高效率;熱模型;3-D IC;Handheld Device;Thermal Analysis;Smartphone;High Efficiency;Thermal Model
公開日期: 2015
URI: http://140.113.39.130/cdrfb3/record/nctu/#GT079713560
http://hdl.handle.net/11536/127629
Appears in Collections:Thesis


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