Title: | Parameter optimization and design aspect for electrocoagulation of silica nano-particles in wafer polishing wastewater |
Authors: | Den, W Huang, C 環境工程研究所 Institute of Environmental Engineering |
Keywords: | CMP;electrocoagulation;nano-particle;silica colloids;slurry;wafer polishing |
Issue Date: | 2006 |
Abstract: | A systematic procedure has been proposed for the design of a multi-channel, continuous-flow electrocoagulation reactor of mono-polar configuration for the removal of sub-micron particles from wastewater. Using the chemical-mechanical-planarization (CMP) process as the target source of wastewater, a series of laboratory-scale studies were conducted to determine the required operating conditions for the efficient removal of the ultrafine particles. These operating criteria included charge loading ( >= 8 F m(-3)), current density ( >= 5.7 A m(-2)), hydraulic retention time ( >= 60 min), as well as the initially operational pH (7 similar to 10). Furthermore, a steady-state transport equation with second-order reaction kinetics was employed to describe the rate of coagulation as the rate-limiting factor, The actual kinetic constant determined from the laboratory-scale experiments was approximately 1.2 x 10(-21) m(3) s(-1), which was three orders of magnitude smaller than that calculated based on Brownian diffusion during the coagulation. The model was subsequently validated with a series of experiments using a pilot-scale electro-coagulation reactor geometrically similar to the laboratory-scale reactor with nearly twenty times volumetric scale-up. |
URI: | http://hdl.handle.net/11536/12777 http://dx.doi.org/10.2166/wst.2006.195 |
ISSN: | 0273-1223 |
DOI: | 10.2166/wst.2006.195 |
Journal: | WATER SCIENCE AND TECHNOLOGY |
Volume: | 53 |
Issue: | 6 |
Begin Page: | 187 |
End Page: | 194 |
Appears in Collections: | Conferences Paper |