標題: Modeling the Embossing Stage of the Ultrasonic-Vibration-Assisted Hot Glass Embossing Process
作者: Nguyen, Lan Phuong
Hao, Kei-Chon
Su, Yi-Hsiang
Hung, Chinghua
機械工程學系
Department of Mechanical Engineering
公開日期: 1-Jun-2015
摘要: Ultrasonic vibration technology has recently been applied in high-temperature forming processes, such as hot upsetting and hot glass embossing. Experimental research has delineated the effects of ultrasonic vibration on reducing required forces and improving the formability of materials. The purpose of this study was to construct a finite element model of the embossing stage of the ultrasonic vibration-assisted hot glass embossing process. Traditional hot embossing experiments in which the embossing speed and temperature were varied were performed to calculate the viscoelastic dissipation caused by ultrasonic vibration, and this value was then inputted into the simulation. The consistency of the force responses in the experiments and simulation indicated that the proposed model is valid. The findings indicate that the influences of parameters such as the vibration frequency, vibration amplitude, and embossing speed on the ultrasonic vibration-assisted hot glass embossing process must be investigated further.
URI: http://dx.doi.org/10.1111/ijag.12090
http://hdl.handle.net/11536/127919
ISSN: 2041-1286
DOI: 10.1111/ijag.12090
期刊: INTERNATIONAL JOURNAL OF APPLIED GLASS SCIENCE
起始頁: 172
結束頁: 181
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