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dc.contributor.authorFu, Yu-Minen_US
dc.contributor.authorLiang, Yen-Juen_US
dc.contributor.authorCheng, Y. T.en_US
dc.contributor.authorWu, Pu-Weien_US
dc.date.accessioned2015-12-02T03:00:57Z-
dc.date.available2015-12-02T03:00:57Z-
dc.date.issued2014-01-01en_US
dc.identifier.isbn978-1-4799-4726-3en_US
dc.identifier.issnen_US
dc.identifier.urihttp://hdl.handle.net/11536/128596-
dc.description.abstractInkjet printing has been one of fascinating techniques for microfabrication owing to the characteristics of low manufacturing cost, low processing temperature, low material usage,. etc. [1, 2]. In this work, a Lift-off Printing (LoP) process combining conventional photolithography and inkjet printing processes is introduced to realize printed size-scalable silver microstructures with the line width of 5 up to 70 m and the resistivity of similar to 5.7 mu Omega.cm on a silicon substrate. In addition, an as-printed interdigitated capacitor with the electrode size and spacing of 10 mu m has been successfully demonstrated with a capacitance of 2.3 pF/mm(2)@10kHz.en_US
dc.language.isoen_USen_US
dc.titleSize Scaling of Printed Microstructures Using a Lift-off Printing (LoP) Processen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2014 9TH IEEE INTERNATIONAL CONFERENCE ON NANO/MICRO ENGINEERED AND MOLECULAR SYSTEMS (NEMS)en_US
dc.citation.spage530en_US
dc.citation.epage531en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000361044400119en_US
dc.citation.woscount0en_US
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