完整後設資料紀錄
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dc.contributor.authorLin, Chun-Yuen_US
dc.contributor.authorWu, Po-Hanen_US
dc.contributor.authorKer, Ming-Douen_US
dc.date.accessioned2016-03-28T00:04:24Z-
dc.date.available2016-03-28T00:04:24Z-
dc.date.issued2016-02-01en_US
dc.identifier.issn0018-9383en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TED.2015.2504493en_US
dc.identifier.urihttp://hdl.handle.net/11536/129638-
dc.description.abstractDiode string was used as the effective on-chip electrostatic discharge (ESD) protection device. To reduce the leakage current and the layout area, an area-efficient and low-leakage diode string is proposed in this paper. The standard steps of P- implantation and silicide blocking in CMOS process are used in this design to realize the proposed diode string with stacked P-/N+ diodes. The test devices of the proposed design have successfully been verified in the silicon chip. With the high ESD robustness, low leakage current, and small layout area, the proposed diode string can be a better solution for on-chip ESD protection applications.en_US
dc.language.isoen_USen_US
dc.subjectDiodeen_US
dc.subjectdiode stringen_US
dc.subjectelectrostatic discharge (ESD)en_US
dc.subjectleakageen_US
dc.titleArea-Efficient and Low-Leakage Diode String for On-Chip ESD Protectionen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/TED.2015.2504493en_US
dc.identifier.journalIEEE TRANSACTIONS ON ELECTRON DEVICESen_US
dc.citation.volume63en_US
dc.citation.spage531en_US
dc.citation.epage536en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000369304700001en_US
dc.citation.woscount0en_US
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