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DC FieldValueLanguage
dc.contributor.author陳柏均zh_TW
dc.contributor.authorChen Po-Chunen_US
dc.date.accessioned2016-03-28T08:17:39Z-
dc.date.available2016-03-28T08:17:39Z-
dc.date.issued2015en_US
dc.identifier.govdocMOST104-2622-E009-016-CC2zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/130284-
dc.identifier.urihttps://www.grb.gov.tw/search/planDetail?id=11478172&docId=462807en_US
dc.description.sponsorship科技部zh_TW
dc.language.isozh_TWen_US
dc.title植入式醫療電子元件生物相容性封裝製程開發(I)zh_TW
dc.titleDevelopment of Biocompatible Packaging Process for Medical Electronics Implants (I)en_US
dc.typePlanen_US
dc.contributor.department國立交通大學電子工程學系及電子研究所zh_TW
Appears in Collections:Research Plans