植入式醫療電子元件生物相容性封裝製程開發(I)

Full metadata record

DC Field	Value	Language
dc.contributor.author	陳柏均	zh_TW
dc.contributor.author	Chen Po-Chun	en_US
dc.date.accessioned	2016-03-28T08:17:39Z	-
dc.date.available	2016-03-28T08:17:39Z	-
dc.date.issued	2015	en_US
dc.identifier.govdoc	MOST104-2622-E009-016-CC2	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/130284	-
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=11478172&docId=462807	en_US
dc.description.sponsorship	科技部	zh_TW
dc.language.iso	zh_TW	en_US
dc.title	植入式醫療電子元件生物相容性封裝製程開發(I)	zh_TW
dc.title	Development of Biocompatible Packaging Process for Medical Electronics Implants (I)	en_US
dc.type	Plan	en_US
dc.contributor.department	國立交通大學電子工程學系及電子研究所	zh_TW
Appears in Collections:	Research Plans