| 標題: | 植入式醫療電子元件生物相容性封裝製程開發( II ) Development of Biocompatible Packaging Process for Medical Electronics Implants( II ) |
| 作者: | 吳樸偉 陳柏均 國立交通大學材料科學與工程學系（所） |
| 關鍵字: | ; |
| 公開日期: | 2016 |
| 摘要: | |
| 官方說明文件#: | MOST105-2622-E009-008-CC2 |
| URI: | https://www.grb.gov.tw/search/planDetail?id=11882955&docId=486395 http://hdl.handle.net/11536/131827 |
| Appears in Collections: | Research Plans |
- 植入式醫療電子元件生物相容性封裝製程開發(I) / 陳柏均;Chen Po-Chun
- 金屬奈米銅Phema混成複合材料之血液相容性改質研究 / 劉典謨;Liu Dean-Mo
- The Perspective of Biomedical Electronics / Wu, Peter (Chung-Yu)
- A cost-effective fabrication of iridium oxide films as biocompatible electrostimulation electrodes for neural interface applications / Chen, Yong-Min;Chung, Tsai-Wei;Wu, Pu-Wei;Chen, Po-Chun
- A BIOCOMPATIBLE AND FLEXIBLE RF CMOS TECHNOLOGY AND THE CHARACTERIZATION OF THE FLEXIBLE MOS TRANSISTORS UNDER BENDING STRESSES / Hsieh, C-Y;Chen, J-S;Tsou, W-A;Yeh, Y-T;Wen, K-A
- A flexible mixed-signal/RF CMOS technology for implantable electronics applications / Hsieh, C. Y.;Chen, C. S.;Tsou, W. A.;Yeh, Y. T.;Wen, K. A.
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