標題: | A flexible mixed-signal/RF CMOS technology for implantable electronics applications |
作者: | Hsieh, C. Y. Chen, C. S. Tsou, W. A. Yeh, Y. T. Wen, K. A. Fan, L-S 電子工程學系及電子研究所 Department of Electronics Engineering and Institute of Electronics |
公開日期: | 1-四月-2010 |
摘要: | A novel post-CMOS fabrication process has been developed to transform a 0.18 mu m 1P6M mixed-signal/RF CMOS (complementary metal oxide semiconductor)-integrated circuit chips fabricated on an 8 inch SOI (silicon-on-insulator) wafer into flexible devices sandwiched between biocompatible material (10 mu m parylene-C on both sides in this case) and enables future implementation of implantable and fully integrated electronic devices. The functionality of the flexible integrated circuits is demonstrated by a low phase noise RF CMOS VCO (voltage-controlled oscillator) circuit in a ring oscillator configuration that operates at a few hundred MHz to GHz. We report here the associated post-processing technology to make these flexible IC chips and the characterization of both MOS transistors and the demonstration circuit on the flexible IC chip under bending stresses. |
URI: | http://dx.doi.org/10.1088/0960-1317/20/4/045017 http://hdl.handle.net/11536/5585 |
ISSN: | 0960-1317 |
DOI: | 10.1088/0960-1317/20/4/045017 |
期刊: | JOURNAL OF MICROMECHANICS AND MICROENGINEERING |
Volume: | 20 |
Issue: | 4 |
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顯示於類別: | 期刊論文 |